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Through-silicon via (TSV) is a critical technology for electrical connection in 3D integration and the formation of insulating layer is one of the most critical steps which directly influence the reliability of TSV package. In this article, silicon dioxide is obtained by a new method based on the formation of the porous silicon (PS). In this experiment, the HF solutions with the concentrations of...
In three-dimensional packaging (3D packaging) industry, through silicon via (TSV) technology is significant which acts as connection between chips and wafers. TSV technology achieves the interconnection through vertical vias and the formation of silicon vias mainly utilizes laser processing technique or deep reactive ion etching (DRIE) technique at the present stage. In this paper, an electrochemical...
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