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Pneumatic diaphragm drop-on-demand (DOD) Technology is an attractive method for Sn conductive lines owing to low-cost, low-waste, and simple process. Based on stable generation of Sn droplets, the process parameters such as droplet spacing and deposition height have significant effect on the final quality of Sn conductive lines. In this work, Sn conductive lines were generated while droplet spacing...
Shrinking features and growing device complexity with today's advanced devices has led to increased challenges of gaining a full understanding of device thermal behavior. At the same time, with higher power densities having a full understanding of the device static and dynamic thermal behavior is essential for ensuring optimal tradeoffs between performance and device reliability. Thermal imaging based...
In this work, a disposable electrochemical immunosensor based on screen-printed electrode with modification of r-GO/Thi/AuNPs nanocomposites was developed onto the chromatography paper for detection of NSE. The electrochemical immunosensor consists of two sheets of chromatography paper and one double-side tape. The carbon working electrode (WE) was screen-printed onto the hydrophilic channels separated...
In semiconductor manufacturing processing, IC chips need to be shipped or transferred to EOL (End of Line), SMT (Surface Mounted Technology) or customers after assembly processing and final test. Before these processes, the dry packing is necessary which is also required by JEDEC (Joint Electron Device Engineering Council) standard. Generally, Tape & Reel packing is a typical method among lots...
This letter presents a dual-band branch-line coupler designed for dual-band operation. The proposed coupler is implemented by using a dual-band impedance transformer. The circuit features low loss (without couple lines or lumped elements) and a compact circuit size (all lines are 90° calculated at the center frequency of two operation bands). Explicit closed-form equations for the dual-band coupler...
A novel equal power divider working at dual frequencies was investigated in this letter. The proposed divider features good isolation, flexible design parameters and frequency ratio. Rigorous theoretical analysis and simulation results are also presented.
High aspect-ratio Ni micro-columns deposited by using intermittent LECD on silver-plate substrate are introduced in this paper. By changing voltage and distance between two electrodes, we can get micro-columns with different morphology. This paper mainly discusses the regulation of this two elements' effect on the surface morphology of columns and the growth speed. Results show that the situations...
The heat dissipation is a crucial factor for the reliability of high power white LEDs(HPLEDs). In this paper, a novel thermal pad structure is presented for HPLEDs, a theoretic thermal transfer model is built to analyze the thermal transferring in LED component. Besides, the thermal simulations of the LED component with the typical or the novel thermal pad are conducted, the temperature distributions...
A switched line microwave digital phase shifter and a hybrid coupler phase shifter using PIN diodes which are operated at center frequencies from 14GHz to 14.5GHz are presented. The former is able to realize 180 degree phase shift and the latter is able to realize 11.25 degree phase shift. The phase shifters are designed to implement on a microstrip circuit type. Both of the two phase shifters can...
With the continuous development of MEMS, very small parts are being made, which propose very challenging task in the assembly process of those parts. The parts are highly coupled with very high accuracy requirements, requiring strict selection and not mutual changeable. These may result in the gap that is too small and jammed or resulting clearance is too large and will cause the loss of job performance...
Vibration reliability test for plastic ball grid array solder joints have been developed by performing vibration tests with constant G-level input excitation. A specially designed PBGA assembly with built-in daisy chain circuits was mounted on a printed circuit board as the test vehicle. The test vehicle was mounted on vibration shaker by four standoffs at the corner of the board. It was then excited...
In this paper, a novel manufacturing scheme based on heat-depolymerizable material and thermosetting material is proposed to achieve high performance through silicon vias (TSVs) with porous polymer insulation liners. In order to strengthen the mechanical reliability and guarantee the low capacitance and low thermal expansion stress of TSVs, we come up with the novel TSVs with porous polymer insulation...
This paper introduces an evaluation method of integrated circuit port protection structure burn-out mechanism basing on transmission line pulse test (TLP). Based on the analysis of a variety of typical ESD protection circuit structures of integrated circuit, the design procedure of TLP test scheme is provided. By establishing functional relation between I/V characteristic curves and the ESD damage...
Optocouplers are devices that block light in one direction but allow light to pass in the opposite direction which are widely used in long distance signal transmission, pulse amplifying circuits and telecommunication equipment. The unique construction, materials, and interfaces in optocouplers that make their failure modes and mechanisms different. This paper presents a definite and comprehensive...
With the widespread use of the flip-chip devices in production, failure analysis of flip-chip is becoming more and more important. As the core of failure analysis, failure localization has encountered many difficulties because of the special construction and increasing complexity of flip-chip. Photon emission microscopy (PEM) and optical beam induced current change (OBIRCH) are widely used methods...
We explored the influence of several electrospinning parameters on the fiber formation and characterized them through the Scanning Electron Microscope (SEM). By utilizing the optimized electrospinning parameters, large-scale alignment quantum rods film had been fabricated and characterized successfully. The photoluminescence (PL) result showed that the polarization ratio is able to be achieved up...
Before mass production, designed IC will be firstly verified using a Multi Project Wafer (MPW) procedure. How to package the MPW chips in a short time with a reasonable price is the common need of design houses. The Quad Flat Package (QFP) cavity carrier provides a “house” to protect the chips, and is strongly accepted by IC design companies and research parties. But usually, the QFP cavity carrier...
As known to all, photometric and colorimetric quality of LED illumination mainly depends on LED chip, phosphor and sealant. The investigation on failure mechanism of the three parts carries critical meanings for improving reliability of LED production. This paper mainly focus on reliability and failure mechanism of the three kinds of phosphor and three kinds of sealant which are wildly used in high...
Surface patterning, in terms of microstructure, as a precise surface roughness method for chip scale package (CSP) LED, will enormously improve the light extraction efficiency (LEE) with much less total internal reflection loss. In this paper, several kinds of microstructures and layouts have been designed and optimized by using the Monte Carlo ray-tracing simulation method. During the simulation,...
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