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Ultrafast laser welding is a fast, clean, and contactless technique for joining a broad range of materials. Nevertheless, this technique cannot be applied for bonding semiconductors and metals. By investigating the nonlinear propagation of picosecond laser pulses in silicon, it is elucidated how the evolution of filaments during propagation prevents the energy deposition at the semiconductor–metal...
In article number 2000433, Maxime Chambonneau, Qingfeng Li, Stefan Nolte, and co‐workers demonstrate semiconductor–metal ultrafast laser welding—an additive manufacturing technique limited to other material families so far. This achievement is made possible by the determination and the precompensation of the nonlinear focal shift in the filamentation regime. This work offers new insights for the fabrication...
Ultra-short breakdown in the bulk of transparent materials has been intensively investigated in the last years, especially in dielectrics [1]. Whereas three-dimensional (3D) femtosecond laser micromachining in dielectrics is highly advanced, it remains extremely challenging in narrow bandgap materials such as silicon (Si). Recent numerical and experimental investigations show that only an underdense...
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