Search results for: Hiroaki Hokazono
Journal of Electronic Materials > 2018 > 47 > 1 > 594-603
Procedia Engineering > 2017 > 184 > C > 238-245
Procedia Engineering > 2017 > 184 > C > 648-654
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 8 > 1139 - 1147
Journal of Electronic Materials > 2014 > 43 > 11 > 4179-4185