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Taking the advantage of high specific surface area, fine silver particles were recently attract much attention since they can be sintered as conductive circuits or joints at relatively low processing temperatures. Although various methods have been applied to produce silver particles, the spray pyrolysis (SP) process has an advantage in its low cost and feasibility for mass production. In this study,...
Along with using faster transmission rate (more than 10 Gbps) and higher transmission frequency (more than 28 GHz) for future 5G applications, there are some challenges must overcome. One is the signal transmission loss at high frequency, the best way to solve this problem is developing low dielectric constant (Dk) and low dissipation factor (Df) materials. The other is the thermal dissipating problem...
SiP modules have been widely used in consumer electronic products. Many different functions are integrated in a SiP module, and these functions generate electromagnetic coupling interference between one another at different frequencies. In order to maintain high performance in all functions in a SiP module, it is necessary to prevent coupling electromagnetic interference (EMI) between adjacent electronic...
2D design architecture facing the performance bottleneck due to memory wall. Several prior researches on 3D architecture exploration have demonstrated that this problem can be solved by using 3D-stacked memory architecture. However, this stacking architecture comes out a serious thermal problem. Since DRAM refresh operations consume a large amount of power, and no previous work study the thermal effect...
For several years, an approach to use fine-pitch flip chip package (<150um) with copper pillar/ microbump is for the realization of 2.5D/3D packages of higher density and performance enhancement. Generally, flux is widely used to clean the surfaces to be soldered for good wetting and form reliable joints. The upcoming concerns about fluxes are clean-ability for fine-pitch package, voiding and compatibility...
The paper is focused on an 8k resolution on large panel generation in TFT-LCDs to detect its appearance, especially green color is the most sensitivity in human vision as well as ten million pixels resolution in the display. The experiment utilizes the machine vision associated with reflective chromaticity spectrometer to quantize the defects of the blackening and whitening onto green layer. A scientific...
Flip chip ball grid array (FCBGA) has been found in wild range such as telecommunication, computer, and workstation application because it provided solutions for high speed demand, high input/output (I/0) density, and high electrical performance requirement. In the conventional FCBGA assembly, heat sink was laminated directly onto the chip surface via an epoxy base thermal interface material (TIM)...
Protrusion adhered onto the glass substrate of the thin-film transistor liquid crystal display (TFT-LCD) is a yield killer to damage the valuable photo-mask frequently. An innovative method using side-view illuminations associated with digital charge couple devices (CCDs) to detect the protrusion for color filter panel of the black matrix (BM) film and photo resistance (PR) red (R), green (G), and...
Rising with consumer electronics, mobile and wearable devices electronic packaging is developed with high power, high I/O, small size and good reliability performance. Among the various packages adopted by industry, Wafer Level Chip Size Packaging (WLCSP) and Ball Grid Array (BGA) possess characteristics mentioned above and therefore widely used in various kinds of devices. However, concerning different...
Thermal circuit models are based on the analogy between heat transfer and current flow equations. A thermal circuit model is extracted from a solid model of the package assembly by means of a mathematical model order reduction (MOR) algorithm. This algorithm automatically generates a SPICE netlist that can be used with standard analog circuit simulator, for simulation of transient operating conditions...
Electroless Nickel Immersion Gold (ENIG) is one of the important final finish techniques that is used in the printed circuit board industry. Despite its relatively expensive cost compared to other final finishing processes such as OSP and immersion Tin etc., ENIG has many advantages. The low reactivity of Au can protect the underlying Ni and Cu surfaces from oxidation and keeps the board suitable...
In this draft, our purpose is to construct a wearable multi-lead electrocardiogram (ECG) recorder with dry metal electrodes. In general, such as arrhythmia, myocardial ischemia or other heart-related symptoms, using one lead ECG measurements is difficult to accurately diagnose, three-lead ECG should be measured at least. In order to offer sufficient identification information, our scheme is a three-lead...
Next generation technologies require an adaptation of the advanced packaging industry. Our industry has to answer the question of how to meet these new challenges such as i) plating copper (Cu) redistribution layers (RDL) of less than 5μm line and space (L/S) in volumes without significant yield losses and ii) plating Cu pillars with much higher speed than current systems. This will require new technology...
This paper presented the embedded operating system internet control for two control system which are synchronous reluctance motor (SynRM) and magnetic bearing system (MBS). Embedded system has human machine interface and scheduling multi-tasking to process interrupt. This paper used ARM9 core construct, in which we used operating system of WinCE system. The operating system sends command signal to...
In this paper, the drilling characteristics of aluminum (Al) entry boards, resin coated Al entry boards, and phenolic resin entry boards were investigated. The chip removal, chip morphology, thrust force, and drilling temperature were measured and analyzed. The cutting characteristics among those materials were compared. In addition, the influence of alloy materials on thrust force of entry boards...
We propose cells can be descended using magnetic attraction, which leads to shorter experimental time and higher efficiency. We used an electroporation chip with adjustable electromagnetic field as the experimental platform, and tested Escherichia coli and 6-nm magnetic beads combined with DNA plasmid. The magnetic beads were positively charged and easy to bind to the negatively charged cell membrane...
This study presented a wireless cloud interaction control system for stepper motor. Cloud control interaction system is an important technology that is call internet of things. Internet of things is an easy control for our appliances which combined different interaction system. This paper proposed a low cost solution of wireless cloud interaction system with microcontroller. The cloud control system...
This letter presents a 1.9mW Quadrature phase Voltage Control Oscillator (VCO) which designed and implemented in TSMC Ο.ΙδμιιιΟΟΜβ 1P6M process for wireless wearable applications. This circuit using NMOS coupling circuit to injected into each VCO cross-couple MOS gate. Another key circuit for low power is class C circuit which lower dc voltage of VCO cross-couple gate side that can reduce power consumption...
In this research, a single sided heating method is developed to solve the issue of metal oxidation at bottom substrate without antioxidant metal coating in chip-to-wafer bonding. By using optimized bonding parameter, the bonding quality and electrical performance is better than double sided heating in chip-to-wafer bonding. With the help of Cu/In low temperature bonding and single sided heating approach,...
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