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This paper will review the challenges on large format encapsulation with respect to mold cap thickness control, encapsulant impact on moldability such as flow mark and flow mark on final product. Control of mold co-planarity is best performed dynamically during molding, otherwise it would be challenging to obtain good co-planarity within ± 20 μm. Moldability demand such encapsulant coverage with highly...
In this paper an integrated wet process (photoresist strip and polymer removal) for through silicon vias fabricated by a Bosch process on a 300 mm single wafer tool will be discussed. A comparison between a dry and a wet post etch residue process, the impact of the physical force (induced by megasonics or spray) and the nature of the wet treatment will be given. Finally the cleanliness of the TSVs...
In this paper, thermal-mechanical reliability of TSV structure was investigated with thermal shock test and finite element method. The fine pitch TSV samples were subjected to thermal load, failure samples were identified by resistance measurement, the calculated characteristic life was about 340 cycles. It is revealed that thermal-mechanical stress is concentrated around TSV, the ends of TSV are...
This paper presents a negative-tone photoimageable spinon dielectric material that is based on a unique molecule for wafer level packaging application. The molecule is an extended polyimide having photoactive maleimide end groups. It is an ideal alternative to conventional dielectric materials for solving both the wafer warpage and temperature cycle RDL crack issues.
In this study, the influence of phosphor particle size gradient on the optical performance of white light-emitting diodes (WLEDs) was investigated. Three multi-size phosphor layer structures with different size gradients were proposed. The YAG:Ce phosphor particles of 3 μm and 13 μm were configured at three different locations to form the size gradient. Both simulation and experimental investigations...
In this study, the roll-to-roll equipment was used to print up to 1000 mm web width and 400mm repeat length. Two screen types, 275 and 325 inch-per-line (ipl) mesh, were studied. The 275 inch-per-line mesh plate has 39 μm opening, 53 μm non-opening, and 83 μm thick and the 325 ipl mesh plate has 30 μm opening, 48 μm non-opening, and 65 μm thick. These screen mesh specifications indicate that the 325...
Crack and dislocation of direct wafer bonded silicon diaphragm on silicon dioxide layer of silicon substrate containing cavity were analyzed. Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and focused ion beam (FIB) were conducted on cracked silicon diaphragm to understand the mechanisms of crack initiation and propagation. SEM analysis results show that the crack initiated...
A micro rotor with high rotation speed is of vital importance for MEMS gas turbine engine to achieve its higher power density and transfer energy with high efficiency. In this investigation, a micro silicon rotor, which is fabricated by one-time multi-depth silicon etching method and supported by a 3-wafers bearing system, is completed to reach high rotation speed. To ensure wafer bonding quality,...
The thermal performance of 2.5D package with integrated processor and 2 memory stacks has been investigated, and 4 types of thermal lids without increasing the package footprint has been designed and evaluated. The heat dissipation capabilities of different structures were first analyzed under natural convection condition, and then forced air cooling condition was considered in portable device scenario...
In this study, a silicon carbide (SiC) device based power module with low profile and enhanced thermal performance is explored. The low profile is achieved by embedded the SiC chips into the direct bonded copper (DBC) substrate which is designed with cavities. The enhanced thermal performance is achieved by eliminating the core layer of the DBC substrate and shortening the thermal path from the SiC...
With the increasing demand for integration of electronics embedded within devices there has been a consequent increase in the requirement for the deposition of electrically conductive materials to form connecting tracks on or within non-traditional substrate materials, such as temperature sensitive polymers, that may also have non-planar surfaces. In this work, micron scale copper powder based materials...
S-parameter is commonly used for channel modeling and crosstalk modeling between channels in high speed digital design. However, for I/O buffer circuit designer, S-parameter models are not well received owing to all general frequency domain data is difficult to incorporate into a transient circuit simulation. S-parameter is a frequency domain data and is difficult to deal in a transient circuit simulation...
Ag alloy wire of high Ag content showed the lower cost and resistivity than the 88%Ag, 95%Ag and 96%Ag alloy wires. In this study, the Au, In, Ni and Cu elements were doped in Ag-2.0%Pd alloy to form the ternary Ag-Pd-Au, Ag-Pd-In, and quaternary Ag-Pd-Au-Ni, Ag-Pd-Au-Cu alloy wires. The interfacial reactions of the Ag alloy wires were investigated after HTST and TCT reliability tests. These tests...
As per the requirements of the market, current semiconductor trend is towards shrinking packages thereby reducing package dimensions. This in turn results in reduced lead pitch and width giving less space for contacting during final testing. Another trend recently observed for the package lead is the shift from matteSn plating towards preplated leadframes or otherwise called uPPF. When it comes to...
In this study, thermoelectric based energy harvesting system which utilizes the temperature gradient between the hot lubricant oil inside the azimuth thrusters and cold sea water outside the azimuth thrusters is proposed. Coupled modeling of the fluid dynamics for the oil flow inside the thruster and heat transfer between the hot oil, thermoelectric generator (TEG) module, other solid components in...
For a large number of industrial, technical processes and in aerospace science, the monitoring and control of water content of solid, liquid, or gaseous materials is a central and quality determining task [1]. In this paper we present our work on development of a humidity sensor array for detecting of absolute trace humidity using Pt-P2O5 electrolytic cells. Many sensor solutions on the market are...
As an inevitable step during ultrasonic bonding of aluminum or copper materials, the removal of oxides that prevent the bond formation is essential for obtaining high quality. Nevertheless, the oxides removal process is still unclear after tens of years' application of ultrasonic bonding. In this project, the removal mechanism was investigated via the analysis of an artificially coated oxide layer...
Printed electronics on flexible substrate is becoming more popular in the flexible and wearable products for biomedical, lab-on-chip and automotive. Flexible printed passive components (resistance, inductance and capacitance) are an attractive solution to the hybrid passives on polymer substrate. Printed resistor can be used as normal resistor, thermistor and heater through the selection of different...
The use of ZnAl based alloy as a Pb-free solder replacement for high temperature die attach application has been previously reported in several work. Work by Min Hao et al shows an alloy consisting of ZnAlMgGe soldered on Cu-based and Ni-Plated leadframe using Programmable Ultrasonic Module (PUM), a patented technology from ESEC. The work shows failure of the ZnAl based alloy under 200°C high temperature...
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