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The paper presents and provide simulation model results of a method for wireless power transfer by harvesting and/or transferring the switching ripple energy of the inductor current in a switching power converter. By placing a planar coil as a wireless power receiver (Rx) in the proximity of a power inductor of a power converter, wireless power can be received by the Rx coil because of the oscillating...
This paper presents a new intelligent power module (IPM) family dedicated for low power industrial inverter drive applications, especially for low cost and compact size requirements. The new IPM family integrates converter, inverter, brake and driver circuits into a compact, high reliable transfer-molded package with fine cell pitch Carrier Stored Trench-gate Bipolar Transistor (CSTBTTM) power chips,...
Silicon carbide (SiC) device is suitable for high temperature application. However, due to the high Young's Modulus of SiC material, the power cycling capability of SiC device is weak in harsh environment. To enhance the reliability of SiC devices, the thermal interface material (TIM) should have high thermal conductivity and long-term reliability. The cold spray low temperature soldering (CS-LTS)...
Increased component integration is essential for new power circuit platforms to decrease cost and size, and increase efficiency and reliability. A 300 W four quadrant (4Q) photo-voltaic grid-tied micro-inverter using two new ASICs (Application Specific Integrated Circuits) was built and characterized. This inverter incorporates maximum power point tracking and dynamically operates throughout a power...
Power semiconductor module is one of the critical components affecting the overall performance of Hybrid and Electric Vehicles (HEV/EV). The design of high quality automotive power module is required by customers in the aspects of performance, temperature, reliability, weight, volume and cost etc. Thermal design is generally believed to address these issues by optimizing the thermal resistance (Rth),...
Industry is adopting GaN HEMT in 10kW–100kW and higher power systems due to the ultra-fast switching capabilities of GaN. Paralleling GaN HEMT transistors is an appealing idea to further increase the power capability and reduce conduction losses of systems. The characteristics of E-mode GaN HEMT, such as positive temperature coefficient of RDS(ON) and a temperature independent threshold voltage, are...
A novel die-attach joining technique based on low-temperature film sintering of nanoporous Cu is demonstrated. Nanoporous Cu films are proposed as a low-cost replacement of nano-sintering pastes with the following benefits: (i) synthesis by electrochemical dealloying, compatible with standard lithography processes; (ii) no organic content to minimize risks of voiding and corrosion; and (iii) controllable...
The feasibility of a 1.2kV GaN switch based on two series-connected 650V GaN transistors is demonstrated in this paper. Aside to achieve ultra-fast transitions and reduced switching energy loss, stacking GaN transistors enables compatibility with high-voltage GaN-on-Silicon technologies. A proof-of-concept is provided by electrical characterization and hard-switching operation of a GaN Super-Cascode...
Silver sinter technology is a very promising lead free interconnection method with high operating temperature, high thermal and electrical conductivity. In high power semiconductor modules the die attach material connects the die to the insulating substrate. These die attach materials need to be optimized to provide low electrical resistance and high thermal conductivity. Various silver sinter materials,...
In this paper, a low parasitic inductance SiC power module with double-sided cooling is designed and compared with a baseline double-sided cooled module. With the unique 3D layout utilizing vertical interconnection, the power loop inductance is effectively reduced without sacrificing the thermal performance. Both simulations and experiments are carried out to validate the design. Q3D simulation results...
Printed Circuit Board (PCB) transformer has been widely used in low power applications. Compared with conventional litz-wire transformer, the manufacture process is greatly simplified and the parasitic is much easier to control. However, in high power applications like on-board charger for electric vehicle, no one has ever done it due to the limitation of high winding loss and high multi-layer PCB...
The problem of ever-increasing energy demand and depletion of conventional resources is well known. In order to meet this growing demand, residential rooftop Photovoltaic (PV) systems, which can cater to the household demand and also supply excess power to the grid, are being encouraged. In this paper, a two-stage transformerless single-phase grid-tied PV system for residential rooftop application...
A non-isolated dual coupled inductors-based bidirectional DC-DC converter is analyzed in this paper for high step-up/step-down applications. The topology is derived by integrating a staked dual-active half-bridge converter (DAHB) into a switched-inductor buck-boost BDC. With the secondary windings of two coupled inductors in series connection, high voltage gain and reduced switch voltage stresses...
Dynamic Voltage Scaling (DVS) has been shown to yield dramatic power savings in modern FPGAs. Because each user-specific hardware design has unique critical paths, the hardware reconfigurability of FPGAs renders the implementation of DVS much more challenging compared to CPUs. A promising FPGA DVS scheme relies on a two-step, offline self-characterization of the minimum supply voltage of the critical...
This paper presents a 5-level Flying Capacitor Multi-Level (FCML) converter with an integrated auxiliary power converter to supply power to the controller and gate drive circuitry. The auxiliary power converter is sourced from within the FCML converter at a naturally occurring low voltage node, reducing the voltage rating requirements by 75% and thus the size of the auxiliary converter. The auxiliary...
The outer voltage control loop is critical important to Static Var Generator (SVG) because it directly relates to the stability of DC voltage. The low frequency active power oscillation of SVG indicates that there may be some interactions when the outer voltage loop is taken into consideration. However, there is no valid and concise model to analyze the mechanism and characteristics of the low-frequency...
Microinverters are capturing the roof-top-PV market due to their plug and play feature, easy installation, and higher power yield under partial shading condition. This paper explores a converter for the transformer-less microinverter with extended-duty-ratio (EDR) boost as the DC-DC stage and doubly grounded inverter as the DC-AC stage. EDR boost is a hybrid of the interleaved boost and switched capacitor...
A simple current-feed single-switch forward resonant converter with secondary diode-clamping is proposed for low power high-density bus converter applications in this paper. The quasi-zero-voltage-switching (ZVS) turn on and quasi-zero-current-switching (ZCS) turn off for switch are both achieved. Due to the quasi-ZCS turn off, the high voltage spike in traditional single forward converter with a...
In this paper, LLC resonant converter with direct output current controlled variable resonant inductor (VRI) is proposed and studied. The output LED current is directly flowing through the auxiliary windings of VRI as the DC bias current to control the inductance of the VRI and no additional control circuit is needed. The VRI is smallest under rated LED current and increases as LED current decreases...
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