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This paper describes the design and development of a nonlinear transmission line based passive RFID tag. When the tag receives a signal from the interrogator, it generates harmonics which are transmitted back to interrogator. The reflected signal is distorted in time domain due to the harmonic contents. Hence, a change in the rise time would be observed in the received signal. Experimentally, a decrease...
The application of electronic devices in harsh environments, such as automotive environment, necessitates that packaging material meet stringent reliability requirements. Underfills not only need to redistribute thermomechanical stress across solder joints, but also should be sufficiently toughened in order to resist crack propagations due to mechanical vibrations and thermomechanical stress expected...
This paper describes advances in integrated ultra-thin wireless power module components for Internet of Things (IoT) and wireless sensor applications. A typical wireless module integrates both an inductive link for wireless power transfer, and supercapacitor as a storage element. The performance of the inductive link is enhanced with innovative high-permeability and low-loss magnetic films for improved...
Due to a weak adhesion, the delamination occurred frequently in the interface between the epoxy compounds and lead that results in a performance failure normally. Several treatments, such as plasma and chemical modifications, have been developed and applied to enhance the bonding force in the interface of both materials. In this study, an anchor shape of the lead, as a mechanical locking microstructure,...
In order to interconnect ultrafine pitch Cu-pillar/Sn-Ag micro bump, Non Conductive Films (NCFs) have been used. During thermo-compression bonding processes, applied pressure and heat make molten solder deform and wet on the sidewall of Cu-pillar. As a result, large Sn-Ag/Cu-pillar sidewall interface reaction makes Sn consumption faster and the Kirkendall void formation. In this study, novel double-layer...
Isotropic conductive adhesives (ICAs) based on metal-coated polymer spheres (MPS) have shown high potential for low-temperature, high-throughput assembly of a transducer array on a substrate in ultrasound imaging applications. The process of bonding and subsequently dicing a transducer stack on a flexible substrate was evaluated. The bonding material was MPS-based ICAs containing a commercial epoxy...
In this paper, silicon/glass/organic interposers for 2.5D/3D interconnects are investigated for signal integrity analysis. As total system bandwidth increases, memory industry has been developed to satisfy its requirements. Therefore, High Bandwidth Memory (HBM) is introduced to the market. HBM enables TeraByte/s bandwidth with extremely fine pitch, short interconnects using Through Silicon Via (TSV)...
This paper presents the use of Finite Element Analysis (FEA) to model a new packaging technique capable of minimizing the impact of bending or shear stresses on components integrated within the yarn of an electronic textile. FEA has been used to model four conditions: shear load, tensile load, three point bending load and a change in temperature. Three types of adhesive (Dymax 3031, Delomonopox Mk055...
Colloidal quantum dots (QDs) applied in illuminants and displays have been offered great prospects due to their narrow and tunable emission bands. However, the QD's incompatibility to encapsulant and sensitivities to oxygen and moisture are still limiting their performance in white light emitting diode (WLED). In this research, we have developed a new kind of QDs composites as QDs luminescent microspheres...
Intravenous cannulation (IV) has a potential medical complication known as extravasation which arise when the fluid accumulates in the subcutaneous tissue layer causing skin swelling symptom. The cost incurred for the addition hospitalization stay and treatment due to the extravasation complication is high. The current detection devices for extravasation is expensive, bulky and it is not suitable...
The advancing heterogeneous integration of various electronic components into a single package requires in particular further development of bonding technologies towards lower temperatures. In our present study, we show the successful joining of dies consisting of Cu-microbumps with In solder caps. Stable interconnections were achieved at a bonding temperature of 180 °C in 2 min by solid-liquid-interdiffusion...
This paper presents the design of three antenna structures of interest for 5G applications. Antenna designs include: 1) pixelated patch, 2) patch with shorting pins and a 3) monopole antenna. Each of the antenna designs are optimized to operate at desired multiple frequency bands while maintaining high gain. These antenna designs are optimized using genetic algorithms, sometimes referred to as evolutionary...
High power consumption & high input/out (IO) density are requested by modem electronic components such as high-density electronics, communication satellites, advanced aircraft, networking server and telecommunication devices. Challenges in the heat dissipation of an electronic package arise from the continued increase in power dissipation and power density of higher-power devices. A thermal interface...
A novel and systematic methodology to predict the warpage of extremely thin packages is proposed. The geometrical and material inhomogeneities of both die and substrate are included in the prediction methodology. The inhomogeneous thermo-mechanical properties of dies due to the thermal incompatibility between silicon substrate and active/passive layers are inversely extracted from the Shadow Moiré...
Exploring along the road of More Moore with integration degree increasing significantly, different wafer level 3-D technologies are developed facing various circumstances. Thermal issue has become an important concern in IC designing and manufacturing. Fan-out wafer level package (FOWLP), as one of the most popular packaging trends lately, compared to high cost through silicon via (TSV) based 3D integration...
Over the last years, singulation of thin semiconductor wafers with (ultra) low-k top layer has become a challenge in the production process of integrated circuits. The traditional blade dicing process is encountering serious yield issues. The seissues can be addressed by applying a laser grooving process prior to the blade dicing, which is the process of reference nowadays. However, as wafers are...
A novel method of fabricating high transmittance and broadband terahertz (THz) polarizers is introduced with several advantages. A polarizer with an approximate 100% transmittance is demonstrated with single central frequency of anti-reflection (AR) layers between 0.5 THz and 2 THz. Broadband polarizer, which has a transmission spectrum of over 70% uniformity, is fabricated by bonding two wafers with...
High bandwidth density on-board optical transmitter is reported in this paper. This on-board transmitter contains 4×12-channel 10Gbps CMOS driver ICs and 4×12-channel 850nm Multimode (MM) VCSEL arrays, with a total 48×10Gbps bandwidth and is packaged through flip-chip bonding on a flexible printed circuit (FPC) with SnAg solder bumps. Due to the compact package design, based on a commercial 1mm pitch...
Elastomer stamp micro-transfer-printing is a highly scalable method for the assembly of microscale components onto non-native substrates. One of the key value propositions of micro-transfer-printing is that the transfer stamp can be scaled to wafer-dimensions and can transfer tens to thousands of micro-devices in a single step, equating to multiple millions of units per hour. Here, we report on the...
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