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The following topics are dealt with: semiconductor thermal measurement and management; thermal market and technology drivers for the future; two phase cooling; modeling and simulation; fans and pumps; microchannel cooling; die level cooling; thermal interface materials; innovative cooling; and package level cooling.
This article investigates the effect of inlet orifices on saturated critical heat flux (CHF) in multi-microchannel heat sinks. Two different multi-microchannel heat sinks made in copper were tested with three low pressure refrigerants (R134a, R236fa, R245fa). One had 20 parallel rectangular microchannels of 467 times 4052 mum (width times depth) while the other had 29 channels of 199 times 756 mum...
Pool boiling experiments are conducted to investigate the heat transfer performance of screen laminate-enhanced extended surfaces in water at reduced pressures. Screen laminations of varying pore hydraulic diameter and specific surface area fine wire screen are bonded to an extended surface (fin). The fins have a 1 cm2 base cross section area, a 5 deg taper with heights of 1 cm and 2/3 cm. Pool temperatures...
A novel design featuring a two-stage expansion process is proposed in this study. Without any help of insulation, the design can minimize or even entirely eliminate the formation of condensate in the cold-plate surface for a typical refrigeration system. The design incorporates a double-pipe inlet outlet and a two-container cold plate. A detailed comparison is also made amid conventional cold plate...
In modeling studies of vapor compression cycles, the momentum balance equation is usually ignored in the dynamic heat exchanger models. However, in micro-scale heat exchangers, significant pressure drop has been observed. In this paper, we investigate the effects of the momentum balance through a systematic study of the open loop stability of a heat exchanger. We consider 1D compressible fluid flow...
Vapor chamber and heat pipe technologies are not new concepts, but their fabrication and manufacturing processes have been improving. Both vapor chambers and heat pipes have been getting thinner allowing the integrated heat sink design with increased fin surfaces. For example, for vapor chambers, the minimum achievable thickness has been reduced from 5 mm to 3 mm. These improvements help enhance performance...
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