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Flying drones are revolutionizing many areas of search-and-rescue, mobile sensing, security monitoring, and beyond. This talk will focus on circuits and system design challenges for SoCs intended for autonomous robotic flying vehicles. The performance, energy, and form-factor requirements of flying robots leads to many unique digital and mixed-signal design challenges. The talk will draw from experiences...
Cars are increasingly driven by electronics to reduce human error, improve traffic flow and to meet environmental regulations. The semiconductor components that enable this functionality range from medium voltage discretes to replace relays to integrated, high-voltage motor drivers with re-programmability at high temperature. In this talk we will review the technology trends underlying the improvements...
With an aging population, the cost of health care has increased substantially over the years. Today nearly 3 trillion dollars are spent in the United States each year, and it is imperative that we keep the climbing health care expense under control while raising the quality and efficiency of the health care. Point of care is a promising path to meet such goals because it promises timely, personal,...
Information technology is the key technology that drives the technical convergence of formerly separated application domains. As the internet started in its early days with a data file transfer approach between geographically separated computers, today the internet already links a variety of devices from a broad application spectrum. While it's interesting to discuss whether new content drives new...
Internet of Things (IOT) has caught a lot of attention recently due to tremendous business opportunities. In this talk, the speaker intends to give the historical figures in PC/ NB and smartphones at first, and then bring in the overall view of IOT. And then it will deploy to various semiconductor technology challenges and opportunities for IOT applications, including micro-controllers, micro-processors,...
Tunable and Reconfigurable applications using RFSOI-on-HR (high resistivity) silicon technology are being deployed in increasing numbers in today's advanced RF cellular handsets in order to provide increasing data rates demanded by the consumer market. These RFSOI solutions are being deployed to meet the demanding specifications of complex 4G RF cellular front-ends with numerous transmit and receive...
One of the great promises of the Internet of Things (IoT) is the extraordinarily large volume of semiconductor components that will be required for smart sensors and actuators, as well as for big digital chips to do the information processing. Yet the growing complexity that comes from shrinking design rules, ultra-low power mixed signal design and diverse packaging are threatening the traditional...
Due to various manufacture difficulties in nano-scale semiconductor devices, certain layout patterns cannot be manufactured properly and cause significant yield loss. Due to the time to run through complete lithography simulation, it is impossible to identify all of them before silicon manufacture. Therefore, post-silicon physical failure analysis is needed to find them one-by-one to improve yield...
Providing IP in today's fast moving technology industry means much more than just delivering RTL. All of ARM's partners are under pressure to produce increasingly advanced products to ever demanding consumers, whilst pressures on cost and timescales are also increasing. The complexities of advanced process nodes and increasing functionality compound the problem as our partners try to provide innovative...
Green design becomes more important in these years. How to enhance the power efficiency is the mainstream of the SoC design. This work will talk about the challenges and possible solutions of each stage in the IC design flow, from the architecture level to the production level.
The rapid evolution of applications in the consumer and mobile space coupled with the emergence of the Internet of Things (IoT) are driving foundries to diversify design-technology solutions. This talk will discuss innovations that are on the horizon to enable differentiation in power, performance, cost, and time-to-volume, while solving the issues with unprecedented integration of “user-experience”...
It is increasingly clear that performance and capacity improvements predicated on Moore's law will not be sufficient to meet projected overall capacity demands in a networked society — in fact more than Moore will be needed. One way to meet these demands is enabled by 2.5D and 3D integration on chip-level. In this note we discuss technical and financial drivers of 2.5/3D from a system integration...
This presentation intends to reveal UMC's viewpoints on how loT will change the landscape of foundry service. The ever-evolving applications and requirements have substantially impacted chip specs and the supporting foundry technologies and IP's, accordingly. This talk will elaborate the interlocks from application specs, design needs, and process technologies and IP's adapting to new power/performance/cost...
With the development of information technology, the power supplies for ITs' products have become more and more important. However, the power consumption and standby power losses for IT products such as data centers are increasing, which become a serious problem. Power electronics technologies are promising for energy saving. In this presentation, the market of power integrated circuits will be addressed...
Wireless microsensors and other miniaturized electronics cannot only monitor and better-manage power consumption in emerging small- and large-scale applications (for space, military, medical, agricultural, and consumer markets) but also add energy-saving and performance-enhancing intelligence to old, expensive, and difficult-to-replace infrastructures and tiny contraptions in difficult-to-reach places...
This talk presents two hydrogel-based devices: a microgripper that can be wirelessly manipulated using magnetic fields, and a passive inertial switch using MWCNT-hydrogel composite integrated with an inductor/capacitor (L-C) resonator. The proposed microgripper can move freely in liquids when driven by direct current (dc) magnetic fields, and perform a gripping motion by using alternating current...
Most of the ASIC designs that we currently encountered are SoC in nature. The success of SoC design methodology relies on the design reuse of existing cores (IPs). The tasks of integrating the cores and creating successful tests for the SoC should not be overlooked. These tasks may need a considerable amount of time from the designers and are inherently error-prone. Conventionally, designers have...
Embedded Flash (eFlash) is widely accepted by various applications because of reducing overall costs of system development, production and inventory. Continuous evolution of eFlash such as the split-gate charge-trapping memory has satisfied the most stringent quality requirement for automotive applications. Smart society for offering a better quality of life would diversify NV memory until the establishment...
Moore's Law has entered a new frontier as the incessant progress of device scaling continues to excel in 10nm and beyond. As the physical dimension of devices and interconnect are being shrunk, the design rules and the design flow, for both ASIC and custom designs, face unprecedented complexity. Hence, common IC design practice can no longer separate the design and the process fabrication indifferently...
Energy autonomy enabled by the energy efficient design and the energy harvesting is the one of the top requirements for maintenance-free IoT sensor nodes and wearable/implanted devices. In this paper, energy efficient ultra-low voltage (< 0.5V) circuits are shown. Energy autonomous wearable healthcare devices using the flexible, large-area, and distributed organic electronics are also shown.
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