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Using SMD packages with high power dissipation is challenging. To cool the SMD power packages, the state of the art solution is to use a PCB with thermal vias to extract the heat from the electronic package [1]. This solution has the disadvantage that the thermal resistance from package to heatsink is relatively high, in the range of 5–10 K/W. A new solution for cooling is proposed, in which the heatsink...
This paper analyses the influence of temperature of the CPU of an embedded device, mainly on the application execution time. The study is performed on an AtMega8L microcontroller, placed in a thermal chamber, where different temperatures were set, to show how increasing the temperature can affect the microcontroller speed. Also, several speed configurations were built, using oscillators of 1MHz and...
The thermal, laboratory model of multi-core microprocessor was fabricated and analyzed. It consists of four separately powered thick-film resistors. Moreover, thermoelectric temperature sensor, suitable for monitoring of small and dynamic temperature changes on the microprocessor/heat sink border, was designed and tested. It consists of two separate substrates connected by nickel and silver wires...
Mechanical stress act on solder joints during transport, function and storage of the electronic equipment. Therefore, the knowledge of solder joints resistance against it is very useful. This article deals with comparison of mechanical resistance of SnCu0,7 and Sn42Bi58 solder alloys. The experiments were based on two PCBs (smaller and larger one, with soldering pads designed according to commonly...
This paper presents a research focused on Aerosol Jet interconnecting of SMD components to flexible substrates. Flexible printed electronics is becoming important fast growing market segment. Contacting technologies of the electronic components are well known for traditional electronics such as soldering, welding, conductive adhesive bonding, however in the expansion of direct printing technologies...
0R0 resistors of the type 1206 were mounted on a test PCB with adhesive assembly to form adhesive joints. The joints were made of four types of electrically conductive adhesives. The adhesive joints were mechanically loaded by bonding of a test PCB with mounted resistors. Then the samples were climatic aged in relative humidity of 85 % at the temperature of 85 °C for 300 hours. The resistances of...
The paper presents modeling of parallel-loaded resonant converter in the development system MATLAB®. A mathematical model is composed using the laws of electrical engineering — specifically the circuit laws of Kirchhoff. The model is evaluated with design parameters suited to represent continuous current operating regime. A comparison for the model's verification is done in other simulation software...
This paper presents spiral inductor fabricated by 3D additive manufacturing. The inductor was made with conductive epoxy silver based paste which was injected in spiral channel fabricated in polylactide (PLA) substrate (model) using additive manufacturing technology. The fabricated structure has value of effective inductance around 415 nH, maximum quality factor around 12 and outer dimension diameter...
This article presents a comparison of various modifications of surfaces of components and the methods of soldering and their influences on the lead-free solders [1]. The parameters studied were the spreadability of solder and offset components. These properties depend not only on the type of solder but also on the modifying of the surface of components. To evaluate a series of samples we used 3D microscope...
The paper presents a design of SRAM circuit using CNTFET transistors. The complete model describing CNTFET, developed in Stanford University is modified for the purpose of designing a 6T (2×2) SRAM memory cell. The simulation results of the CNTFET SRAM memory cell manifest usability and applicability of the modified CNTFET model in designing digital circuits. The simplified CNTFET model is coded in...
In this paper are presented the results regarding the simulation and the implementation of an enhanced communication interface based on pulse position modulation technique. The proposed module is aimed for integration in the conditioning circuits of the sensors that are connected to data acquisition systems which require transmission of information signals over short to moderate distances. Because...
In this paper the combination of solid-state interdiffusion with silver sintering is presented as a supplementary technique for assembly of high temperature devices. The design of the experiments technique is used to study the influence of process temperature, time and thickness of used Sn layers on the assembly process. Identical pressure for assembly and flux application was used in every experiment...
This paper presents a research focused on Aerosol Jet printed lines on subsequently bent glass substrates. The thin glass rods were used as the glass substrates. Three different patterns were printed by silver nanoparticle ink on the thin rods and the ink was sintered. The thin rods were bent in a flame in different angles after the ink sintering. The resistivity was measured before and after the...
Electric Double Layer Capacitors (EDLCs) are relatively new electronic components developed in the late 1980s; their operation is based on a Helmholtz double layer of charge formed on an activated carbon surface (of high equivalent surface) and an electrolyte. The advantages of this constructive solution are a very small capacitive distance and large effective capacitive area, leading to remarkably...
This paper presents a research focused on a comparison of two antennas made on a textile substrate by two different technologies and optimized for Ultra-Wideband (UWB) communication. The first used technology was embroidering and the second one was screen-printing. The objective of the research was to achieve a flexible and washable antenna which would be possible to integrate into clothes without...
This paper presents possibility of realization of capacitive displacement sensor in additive manufacturing technology. A 3D printing fused filament fabrication approach has been implemented for the creation of sensors structure. Sensor casing for bottom electrode, spacer and top cover were fabricated by employing 3D printer and Polylactic acid filament. Top capacitor's electrode (movable element)...
The current paper describes an innovative navigation system based on GPS receiver and high speed 9 DoF IMU based on MEMS inertial sensors (3D linear accelerometer and 3D magnetometer and 3D gyroscope) which accomplishes the real-time read of the navigation and inertial data and write to FLASH memory. Also the system may transmit the data by Bluetooth or GPRS modem connected externally to the remote...
Force-curves measured by Atomic Force Microscopy (AFM) are frequently used to determine the local Young's Modulus of the sample. Originally the AFM (Atomic Force Microscopy) instruments measure the cantilever deflection as a voltage signal; however the natural unit of the deflection is nanometer. In general, the V/nm conversion factor is determined from the force-curve of a hard sample. Since this...
Food preservation has become nowadays a major priority. Classical methods of storing food relies on controlling the temperature and humidity in storage areas. The present work is proposed another method which relies on complete air purification storage space. It is known that leading to food spoilage is the presence of bacteria and microorganisms. The presented method is based on purifying the air...
Thickness control data measured at different fabrication stages of atomic force microscopy (AFM) self-sensing cantilevers are presented in this paper. Specifically, the thicknesses of multilayered structures comprising silicon, silicon dioxide and thin patterned layers have been measured in-line during multi-step devices' processing. The data of the electrically detected resonance frequencies of the...
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