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This paper demonstrates a new class of inorganic-organic hybrid dielectric materials to address the requirements for high-temperature reliability of next-generation high-density, high-power packages and electronics in harsh environments for automotive applications. A major concern for reliability is the inadequate adhesion of metals with high-temperature polymers. Adhesion deteriorates further via...
Positive-tone photo-definable poly(benzoxazole) (PBO) has been widely used as dielectric for re-distribution layer of wafer level chip size package. This material can simplify the manufacturing process and ensure the reliability owing to its good mechanical properties and high thermal stability. However, lithographic performance of conventional photo-definable PBO is not enough mainly due to low dissolution...
Ultra thin temperature responsive polymer, poly(N-isopropylacrylamide) (PIPAAm) grafted layer exhibits cell attachment and detachment properties in response to temperature change. Such properties are dependent on thickness and amount of the grafted PIPAAm, and are observed for extremely ultra thin thickness (for example, 20 nm thickness for tissue culture poly styrene and 5 nm for glass cover slips)...
Poly(N-isopropylacrylamide) (PIPAAm) was covalently grafted on glass coverslips (PIPAAm-CSs) by electron beam irradiation. Thickness and amount of the grafted polymer amount were increased with the initial monomer concentration. PIPAAm-CSs with thicker and larger amount of the grafted polymer exhibited more hydrophilic surfaces. When the monomer concentration was 5 wt%, the grafted polymer density...
In this paper, the effects of thermal cycling on material properties such as coefficient of thermal expansion (CTE), modulus, and glass transition temperature (Tg) of nonconductive pastes (NCPs) for flip chip applications were investigated. Using a thermomechanical analyzer, the dimensional changes of NCPs and an underfill material were measured. The dimensional changes of all materials during the...
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