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The effects of thermal aging and electromigration on the tensile strength and microstructure of SnAgCu micro-interconnection solder joints with different volume were discussed in this paper. The experimental results show that isothermal aging results in coarsening of the microstructure in the solder joint, and electromigration leads to micro-hole or micro-crack in the cathode interface, which bring...
Electroplated Ni/Au over Cu is a popular metallization for printed circuit board (PCB) finish as well as for component leads, especially for wire-bondable high frequency packages, where the gold thickness requirement is high (≥ 20 µinches) for wire bonding. This study examines the effect of redeposition of bulk AuSn4 IMC as a function of varying gold content (2–5 nominal weight-%) in the solder joint...
A new lead-free solder alloy Sn3Ag0.5Cu3Bi0.05Cr (SACBC) was prepared by adding 3.0 wt.% Bi and 0.05 wt.% Cr on the basis of the composition of Sn3Ag0.5Cu(SAC). The tensile strength and the growth behavior of the interfacial intermetallic compound (IMC) of SAC/Cu substrate and the SACBC/Cu solder joints during isothermal aging at 150°C for 0, 24, 168, 500 and 1000 hours were comparatively investigated,...
The influence of the standoff height, pad size and isothermal aging on the microstructure and shear fracture behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured interconnects were investigated using the lap-shear test. The experimental results show that the thickness of intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing standoff height of the joints. The size of Kirkendall...
Sn-Ag-Cu (SAC) and Sn-Ag alloys are considered to be the most promising Pb-free solders for electronics applications. The properties of these solders can be improved by the addition of minor alloying elements to control the intermetallic compounds (IMCs) that are formed during soldering and high temperature storage/cycling. Additional alloying elements into the solder alloys change the solidification...
The atom diffusion and growth behavior of intermetallic compound (IMC) at Sn3.5Ag0.5Cu/Cu interfaces under isothermal aging and thermal-shearing cycling conditions were investigated. The results show that the morphology of Cu6Sn5 IMCs formed at Sn3.5Ag0.5Cu/Cu interface changed gradually from scallop-like to chunk-like, and IMCs thickness developed with the isothermal aging and thermal-shearing cycling...
The growth behaviors of interfacial intermetallic compound for the solder joints of Sn-3.0Ag-0.5Cu/Cu substrate and Sn-3.0Ag-0.3Cu-0.05Cr/Cu substrate during isothermal aging at 150deg for 0, 24, 168, 500 and 1000 h respectively have been investigated. The results showed that the intermetallic compound layer at the Sn-3.0Ag-0.3Cu-0.05Cr/Cu joint is much thinner than that at the Sn-3.0Ag-0.5Cu/Cu joint...
The goal of this research is to evaluate the effects of La addition on the microstructure and microhardness of Sn-Ag based solders. Sn-3.5Ag-xLa ternary alloy solder were prepared by adding 0-1.0 wt% La into a Sn-3.5Ag alloy. Copper substrates were then dipped into these solders and aged at 150degC for up to 625 hours. The microstructure and microhardness of the as solidified solder and the aged solder/copper...
The reliability of lead free electronic devices depends strongly on the reliability of the soldered joints while the later one was controlled, mainly, by the formation and growth of the interfacial intermetallic compounds (IMCs) between the solder matrix and the substrates. The morphological features, microstructural evolutions and growth kinetics of the IMCs on the interfacial of SnAgCu/Cu soldered...
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