The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The effects of thermal aging and electromigration on the tensile strength and microstructure of SnAgCu micro-interconnection solder joints with different volume were discussed in this paper. The experimental results show that isothermal aging results in coarsening of the microstructure in the solder joint, and electromigration leads to micro-hole or micro-crack in the cathode interface, which bring...
Although lead free soldering has been the main stream of industry since 2006, with the replacement of eutectic SnPb system by SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far from mature. BiAg alloy exhibits acceptable bulk strength but very poor ductility and wetting, therefore is not acceptable as an option. In current work, a...
Lead free soldering has been the main stream of industry since 2006, with eutectic SnPb system phased out by SnAgCu system. However, development of lead-free alternatives for high melting high lead solder alloys is still struggling, thus hampering the completion of full lead-free conversion. BiAg alloy exhibits acceptable bulk strength but very poor ductility and wetting on copper, therefore is not...
This paper deals with presentation of some new aspects of solder ternary alloy 96.5Sn3Ag0.5Cu (wt.%) - SAC305, in order to determine variations in mechanical properties and microstructure caused by treatment in vapour phase soldering (VPS) as well as by accelerated isothermal aging. These specimens have been melted and solidified on HASL (hot air solder levelling) and Ni/Au (ENIG) PCB (printed circuit...
The drawback of Sn/Ag/Cu solder alloy on selective Ni/Au plating (SMOBC) TBGA substrate is weakened solder joint, which promote the embrittlement and affects long-terms reliability. The ability of electronic packages and assemblies to resist ball drop failure is becoming a growing concern recently. In this paper, test vehicles of Sn-Ag-Cu (SAC) solder alloys with different Ni thickness of 3, 5, 8...
The growth behaviors of interfacial intermetallic compound for the solder joints of Sn-3.0Ag-0.5Cu/Cu substrate and Sn-3.0Ag-0.3Cu-0.05Cr/Cu substrate during isothermal aging at 150deg for 0, 24, 168, 500 and 1000 h respectively have been investigated. The results showed that the intermetallic compound layer at the Sn-3.0Ag-0.3Cu-0.05Cr/Cu joint is much thinner than that at the Sn-3.0Ag-0.5Cu/Cu joint...
Conventional assessment of solder joint reliability uses either ball shear test or solder ball pull test. The test results are reported in terms of materials strength in either shear or tensile mode, and the strength values are size-dependent. Therefore these test results are largely useful only for qualitative comparison and qualification of the products. In the current effort, we aim at developing...
The microstructures of SnBi/Cu interconnect after reflow and its evolution during solid-state aging at 393 K were investigated using transmission electron microscopy (TEM). It was found that after reflow there were two kinds of intermetallic compounds (IMCs) - Cu6Sn5 and Cu3Sn in solder joint. Above these IMC layers there was a Bi-rich layer which consisted of discontinuous Bi particles. During solid...
In the present work, Kirkendall void formation and drop impact reliability between Pb-free solder and Cu metallization were investigated. Pb-free solders, Sn-3.5 Ag and Sn-3.5 Ag-xZn (x=0.1, 0.5, 1, 3, and 7 wt%), were reacted with Cu metallization. After thermal aging of Sn-Ag solder on electrodeposited Cu at 150degC, Kirkendall voids were distributed either in the Cu3Sn layer or at the Cu/Cu3Sn...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.