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Copper/tin thermo-compression bonding technology has been a focus and hot spot of global research institutions for a long time. Inter-diffusion and intermetallic compound (including the metastable η-phase Cu6Sn5 and the stable ε-phase Cu3Sn) formation will occur at the bonding interface during the heating and pressing step of bonding experiments. Considering that tin is easily oxidized and copper/tin...
Alternative solutions to gold wire are being sought as a for lower cost packages. Palladium coated copper (PCC) wires serve as a potential alternative to increase package robustness and lower package cost particularly in the automotive industry. Palladium on the surface of the wire promotes better adhesion of the wire to the surface where it is bonded. In effect, this may result to elimination of...
In recent years, as IC packaging development has moved towards higher power, smaller size, thinner dimensions, denser circuits and higher reliability, wire bonding is still the most commonly used bonding interconnection technique in first level microelectronic packages [1]. Gold wire is usually used for bonding to connect the chip and lead frame/substrate metallization because of its easy handling...
This paper compares and discusses the influence of shear strength {in terms of (SPMS) shear-per mils-square} of Au and Cu ball bonds on the biased humidity reliability performance in SOIC 8LD leaded package. Biased HAST (Highly Accelerated Temperature and Humidity Stress Test, 130°C, 85%RH) has been carried out to estimate the long term reliability of Au and Cu ball bonds. Lognormal reliability plots...
Cloud computing and storage now are more important for people's life. Data center set-up is more popular all over the world. For the cooling of the computing server, a lot of data center choose the natural air circulation method replacing traditional one to save the power consumption. So from the natural air circulation, more reliable issue will come from the quality of air depending on which place...
Gold wire has been high volume production in 1С packaging industry. With soaring price of gold in recent years and 1С packaging search for cost reduction, copper wire offers 2nd alternative for wire bonding type assembly. But copper wire has drawbacks in control issues such as pad crack, aluminum splash, cratering and low throughput, Cu wire need a more complex multi-processing program to solve above...
Pd-coated copper wire bonding is getting more practical applications in electronic packaging because of advantages, such as ease of use, better bonding performance and reliability. ENEPIG (Electroless Ni Electroless Pd Immersion Au) is a prevalent surface finish technique that can realize more flexible substrate design, increase wire density and hence achieve device miniaturization. Study had been...
This study assesses the reliability of the high-temperature storage (HTS) test and high humidity/high temperature (HH/HT) test for an assembly of chips thermosonically bonded onto flex substrates. Environmental parameters used in the HTS and HH/HT tests were consistent with joint electron device engineering council (JEDEC) specifications. The die-shear test was applied to examine changes in die-shear...
As the most promising candidate for the realization of high-efficiency light sources for general lighting, the high power lighting emitting diodes (LEDs) still have reliability issues that hinder the large scale application of LED devices. Nowadays, the reliability is becoming an essential barrier for LED devices to substitute the traditional light sources. Before it is applied into mass production,...
The Resistor Capacitor (RC) model is used to analyze circuit parameters for a CNT-bundle interconnects. In this paper the performance of the single CNT interconnection with Cu and Au using predetermined equations was attempted first. Due to poor yield of single CNT, bundle of CNT was analyzed and eventually the performance of the CNT-bundle, copper and gold interconnects was compared respectively...
In this paper, we will compare Cu wire and Au wire behavior during pull test and package reliability test through thermo-mechanical simulation. Relationship between wire pull test and package reliability test, i.e. thermal cycling, is also evaluated in term of die stress underneath the wire bond pad area. A new stress index concept is proposed to characterize the overall die stress level underneath...
The industry has traditionally maintained an average 15% cost down per year per function over the range of products it offers. Part of this reduction comes from packaging where manufacturing efficiencies such as cycle time reduction. supply chain management, and yield improvement allow for continued reductions in the cost per I/O. As the leaded package families are expected to increase in volume,...
Historically Cu wire has been targeted to lower pin count high power discrete devices and consumer product for a long time. As gold costs increased the industry started focusing on moving more mainstream products to Cu wire. Markets that have seen the largest growth in Cu wire bonded products include consumer electronics, communication devices and industrial electronics etc. However, Cu wire has been...
Wire bonding has been the predominant interconnect technology for more than 40 years and even today is holding a market share of more than 85%. The standard wire material has been gold albeit copper and aluminum wires have been used for 20 or so years in power applications. In the past few years, economics, i.e. the explosive increase in gold commodity pricing, have lead to a rapid conversion of fine...
The effects of multiple reflows and thermal shock on interfacial reaction of the solder joints between Sn-0.3Ag-0.7Cu solder/pads (HASL, OSP, electrolytic Ni/Au and ENIG PCB finishes) were systematically investigated in this work. The results showed that the scallop Cu6Sn5 phase were formed in HASL and OSP finish pads during reflows, whereas the cylinder-type (Cu, Ni)6Sn5 near the solder and needle-type...
The project VISA (German abbreviation of “fully integrated power electronic systems for automotive electronics”) gives an answer to future challenges to electronic printed circuit boards in automotive applications. VISA was a three year funded project by the Federal Ministry for Education and Research. The i² Board concept, developed by Schweizer Electronic was investigated for automotive application...
Copper wire bonding on pre-plated leadframe (PPF) is an ever-increasing mode of interconnection in electronic packaging to substitute the gold wire bonding in the volume production in the forthcoming years. Reliability from copper wire bonding should however be well known before putting the process into manufacturing. In this letter, the 4N copper wire with 50 μm diameter bonded on PPF substrate was...
In order to match high power density and large counts of I/Os with the need for smaller-sized automotive electronic devices and low cost, new solutions have to be developed without any concessions to reliability. The authors describe the so-called i2Board concept, developed by Schweizer Electronic AG and used in the VISA project, funded by the German Government. VISA is an abbreviation and means "fully...
With the current gold price, the semiconductor industry finds itself caught in a dilemma. The industry has traditionally maintained an average 15% cost down per year per function over the range of products it offers [1]. Part of this reduction comes from packaging where manufacturing efficiencies such as cycle time reduction, supply chain management, and yield improvement allow for continued reductions...
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