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Optimizing wet etch recipe for meeting a target (e.g. Uniformity) typically involves the tuning of multiple parameters; a process that is time consuming and expensive (in terms of tool time, engineering time and material used). In addition, because the process is ultimately constrained by the handful of nozzle test positions available due to hardware limitations, very often the final settings are...
A convenient model is presented for the expedient calculation of semiconductor substrate-induced noise coupling under quasi-static conditions. The proposed model is motivated by the desire to provide for a quick means for predictive assessment of substrate noise levels with computational efficiency appropriate for noise-aware floor-planning and routing considerations early in the design phase. While...
The present paper deal with research and comparison of models of thermal oxidation of the silicon, used in TCAD Sentaurus Process and Fact. Data comparative analysis of modelling of typical industrial modes is done. Conclusion concerning models urgency and applicability is made.
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