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Advances in small scale fabrication processes have led to the advent of very thin flexible devices such as flexible RFID tags and smart clothing. In a geometrical sense, these present themselves as curved 2D open surfaces embedded in a 3D domain. When simulating EM behavior on these surfaces at low frequencies, a full 3D field model can become computationally expensive in terms of memory and run times...
Model-driven engineering is constantly gaining importance, expanding to domains varying from the Web to the 3D graphics. Domain-specific languages besides contributing to the development process can be used in a didactic process conducted not only in schools. Thus this paper introduces new domain-specific language and discusses its usage in teaching construction of shaders and materials while working...
CAM systems are most widespread way to create cnc programs. Possibility of optimization, simulation of machining, shorter lead time, and flexibility are biggest benefits. Some of most used CAM systems are GibbsCam, PowerMill, AlphaCam, Surfcam, and Edgecam. Next article shows making of NC program in Edgecam. Edgecam was chosen because is user friendly and simple programs can be created without deeper...
Topic of this paper is the efficient modelling and simulation of state-of-the-art roof antennas employed for vehicles of the AUDI AG. In the investigated roof antenna, several services are joined within one antenna assembly covered by a common housing. To investigate whether the antenna fulfills all specifications concerning scattering parameters and radiation patterns, the antenna needs to be simulated...
The product configuration design is a customization product design technology used in an intelligent design system. An intelligent artwork customization design system named 3D Artwork Design System (ADS) has been developed by us. In the system, how to choose the optimal scheme from several ones produced in the system is a problem to be solved. Analytical Hierarchy Process (AHP) is one of the best...
This paper presents the development of a hexapod robotic research platform for academic use, this platform is characterized by having a virtual environment and a physical model, both for testing and validations. The development emphasizes on procedural character and it has defined stages: Mechanical Design, System Modeling, Embedded System and Control Interface. The mechanical design: preliminary...
The electrical performance and reliability of a through-silicon via is investigated through two-dimensional and three-dimensional simulations. Due to the large differences in material thicknesses present in the structures, a 3D simulation is often not feasible. The thermo-mechanical stress, the electrical parameters including TSV resistance and capacitance, as well as the electromigration-induced...
Although the traditional finite volume scheme based on boxes obtained from the dual Voronoi grid has been employed successfully for classical semiconductor device simulation for decades, certain drawbacks such as the required Delaunay property of the underlying mesh limit its applicability for two-and particularly three-dimensional device simulations on unstructured meshes. We propose a discretization...
We briefly discuss the evolution of Non-Volatile Memory (NVM) technology in term of macro-trends and their implications for modeling activities in an industrial R&D environment. Some examples of difficult modeling issues for different NVM techologies are mentioned, and finally both present needs and future challanges are critically reviewed.
Laser cutters are increasingly relevant within many user contexts and have become an essential tool for model building and prototyping. While providing precision and flexibility, these tools are typically suited for expert staff in industrial settings. VAL (Visually Augmented Laser cutting) proposes a novel system utilizing spatial augmented reality techniques to provide visual augmentation directly...
In recent years, power electronics solutions spread through fields ever less tied to a pure industrial context for embracing on-coming applications in consumer, automotive and renewable energy markets. In all those contexts several requirements drive engineers in implementing assemblies having increasingly strict constraints as high power density, optimal management of temperature, and a more and...
In 3D through-silicon-via (TSV) interposer package, there are large numbers of micro bumps and micro solder balls, the sizes of the entities in the package having a difference of 3 orders of magnitude. This multi-scale structure brings difficulties to establish the finite element model for analyzing the thermal fatigue life of board-level solder joint. Homogenization method is adopted to avoid these...
A typical 3D-BGA packaging model was set up and numerical simulation method was used to study its thermal field and thermal stress field distribution when chip works on a given power. Different heat convection coefficients and packaging materials had been applied to study their effects on the temperature and stress field. The results show that the influence on the temperature and stress field decreases...
Conductor tracks comprise a frequency dependent attenuation of electromagnetic waves, since with increasing frequency the current flow is displaced to the near surface region due to the skin effect. Therefore, the effective length of the conductor is increased by the surface roughness, while its effective cross-section is decreased by current displacement, both leading to higher metallization loss...
3D Printing or Additive Manufacturing (AM), refers to a new class of technologies of making products directly from any three-dimensional digital models. Broader applications of AM require to lower the cost of AM machines. However, products fabricated by low-end machines suffer from the issue of low dimensional accuracy. In this paper, we intend to address this issue for Fused Deposition Modeling (FDM)...
The implementation of a virtual environment is challenging when the area to be covered is of large scale with existing objects such as historical buildings, castles, city neighbors, traditional villages etc. The desire for high fidelity is compromised by the computer machine limitations thus imposing a certain trade-off between fidelity and performance being thoroughly investigated in this work. In...
A novel scheme for single-rate compression of material and texture attributes for triangular meshes is proposed in this work. For the material coding, it proposes a novel approach based on breadth-first surface traversal, exploiting the local coherence of the material attributes among neighboring facets; for the texture coordinate coding, it proposes a similar-triangle-based prediction method, exploiting...
The first step in FEM-based deformation is voxelization, which means objects showed in original mesh will be desecrated into mass of small units (voxels), and then the characteristic matrix can be fetched with the coordinate, shape, and attributes of voxels. This paper focuses on the reciprocity between specifying voxel physical parameter and simulating the deformation. A table list out provides physical...
An analysis on properties of mechanical fatigue and solid insulation during aging process should be made to reveal which ones we have not found in previous studies. Especially, the initiation and growth of electrical trees and mechanical fatigue are extremely similar. In this paper, a detailed comparison is made according to the theory of electrical trees and mechanical fatigue, and a simulation is...
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