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We implement amorphous-Al2O3 as а thermally-conductive shield in metallo-dielectric nanolasers, and demonstrate an electrically pumped device. Joint consideration of various design parameters reveals that this design allows the laser to dissipate heat through its shield, aiding thermal management in nanoscale devices.
An investigation is reported into the structure of Ball Grid Array/Permanent Stencil/Printed Circuit Board interconnects produced when semi-elastomeric bituminous stencils are formed or placed within standard interconnects. Such interconnects have the potential to extend the service life of Printed Circuit Boards especially for use in aviation, shipping and military applications.
This paper presents a comparison of the thermal properties between infiltrated and non-infiltrated copper windings. The focus is on thermal conductivity in the radial direction on the winding. The samples have a fill factor above 65 % due to the manufacturing method of the samples. Samples are produced and measured with the transient plane source technique and then compared to FEM simulations and...
Electrode material seriously influences the characteristics of vacuum arc and further affects the performance of switches. In this paper, thermal processes of six kinds of metal anodes (including pure metal and alloy anodes) are simulated and researched. Two kinds of temperature calculation methods are used. Simulation results show that W and Mo anodes have the higher temperature than Cu, Cr, CuCr25...
This paper deals with the development of a new test stand for determination the thermal conductivity of metals, semiconductors, highly conductive die attaches and substrates using the steady state technique. We designed the test stand and optimized it by FE simulation to have flexibility for the selection of the sample size and measurement parameters. We determine the thermal conductivity from the...
Solid State Lighting technologies are becoming more and more attractive in the lighting market. Thermal management is a key issue, which impacts efficiency but also colour stability and reliability of LED-based systems. In this paper, we describe and discuss such issues through various examples of different projects by analysing both the heat transfer mechanisms and their impact on the choice of materials...
Nowadays monitoring physiological signals in real situations is essential to get the best diagnosis on patients. In this study we focus on the heat flux generated by the human body. We are developing a portable heat flux sensor using specific thermal materials.
According to Moore's Laws, complexity and power densities of electronic devices are increased during the last decades, moreover their dimensions are shrinking to nanometers causing hot-spot temperature escalation. Thermal management, therefore, becomes a critical issue for next generation of electronics. This scenario motivates development of novel thermal conductive adhesive (TCA) with enhanced thermal...
First principles-based calculations of the electronic and phonon properties of monolayer MoS2 are performed to assess the thermoelectric performance of this 2D material. By comparing monolayer MoS2 to bulk Bi2Te3, a good and well-characterized thermoelectric, it is found that the intrinsic properties of MoS2 are similar to Bi2Te3 in terms of thermoelectric figure-of-merit. While the advantage of Bi...
In this paper we study the thermoelectric (TE) properties of graphene nano-ribbons (GNRs) with incorporated nanopores (NPs), and present a nanopore-engineering approach for enhancing their TE properties. The nearest neighbor tight binding (TB) model and Non equilibrium Green's function (NEGF) method were employed to obtain the electron transmission spectra. For phonon calculations, Tersoff potential...
Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
Thermal interface materials (TIMs) which consist of metal foil and soft cushion are used in the process of chip processor platform validation (PPV) process, and some defects, such as the stains caused by debris peeled off from TIMs due to stress concentration, were found on the surface of the chips and they had an hazardous influence in the testing process. As well as that, the thermal resistance...
Measurements of physical transport properties of thermoelectric materials are plagued by large uncertainties (of tens of percent). Development of new materials towards larger efficiency in converting heat into electrical energy would benefit from improved measurement reliability. We are proposing to extend the 3ω method for the simultaneous measurement of the Seebeck coefficient, electrical conductivity...
Thermoelectric (TE) microcoolers are solid state devices widely considered as strong candidates for precise temperature control and spot cooling in microelectronic circuits, especially for temperature sensitive devices such as laser diodes.
Currently, a variety of Thermal Interface Materials (TIMs) are required to meet specific requirements for various products with no single TIM meeting the needs for all CPU market segments. Surface treatments, reflow temperatures, mechanical load, performance targets all play a role in choosing a specific TIM. Based on the above multitude of conditions, it is desirable to find a universal TIM that...
Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
Thermal interface materials (TIMs) which consist of metal foil and soft cushion are used in the process of chip processor platform validation (PPV) process, and some defects, such as the stains caused by debris peeled off from TIMs due to stress concentration, were found on the surface of the chips and they had an hazardous influence in the testing process. As well as that, the thermal resistance...
According to Moore's Laws, complexity and power densities of electronic devices are increased during the last decades, moreover their dimensions are shrinking to nanometers causing hot-spot temperature escalation. Thermal management, therefore, becomes a critical issue for next generation of electronics. This scenario motivates development of novel thermal conductive adhesive (TCA) with enhanced thermal...
Consumer electronics such as portable devices (laptops, smartphones) become smaller, thinner and more powerful. In such devices a passive cooling begins to play a dominant role in heat dissipation process. In passive cooling systems thermal resistance of thermal path between semiconductor junction and radiator should be progressively reduced. It can be done by application of efficient (high thermal...
Reliability testing of thermally conductive, high-temperature, high-dielectric strength materials was conducted using newly developed high-temperature thermal conductivity and high-dielectric breakdown voltage characterization instruments based on ASTM Standards. These instruments and tests were used for optimizing thermal conductivity and dielectric breakdown of Bismaleimide Resin (BMI) - Boron Nitride...
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