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This paper presents a 3-D differential folded Hall sensor (HS) fabricated using standard 0.18-$\mu \text{m}$ CMOS technology; this HS includes 1-D folded lateral Hall sensor (FLHS) and 2-D folded vertical Hall sensor (FVHS). The proposed 3-D HS is laterally folded to reduce the effective conduction length and to decrease the offset voltage; a p+ guard ring is used to narrow the conducting channel...
This paper presents the design and implementation of the differential Dickson voltage multiplier with a matching network which is used in the radio frequency (RF) energy harvester at GSM frequency band. The proposed RF energy harvester consists of a matching network and a Dickson rectifier. Those circuits are designed and simulated with standard TSMC 0.18 µm 1P6M CMOS process. The matching network...
This paper focused on the design of a 2+1- order Switched-current MASH Delta-Sigma ADC with the digital cancellation circuit in TSMC 0.18-µm 1P6M CMOS process. To combat errors in MASH architectures, we have to cancel the errors by utilizing a pertinent digital cancellation circuit; the output of digital code contains the numbers and position of characteristics to the latter part of the digital filter...
Three-dimensional integration suffers from heat dissipation between the layers due to the power consumed by various resources. In this paper, we show the significance of distribution of power density among the layers of a three-dimensional integrated circuit structure which can reduce the overall chip temperature as well as the peak temperature. Our experiments are developed using industry standard...
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