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In this paper, research activities on the reliability for bare die connections on molded interconnected devices (MID) and flexible substrates are presented. The results were achieved by experimental, thermo-mechanical stress characterization combined with finite element analysis (FEA) of the assembly during application specific environmental conditions. Aim of the work is to determine the influence...
Aerosol-Jet-Printing is an interesting approach to apply circuit tracks on three dimensional thermoplastic circuit carriers used for Molded Interconnect Devices. Therefore, possibilities for printing nanoparticle silver inks on substrate materials that meet the requirements for basic automotive applications were investigated from the view of manufacturing. Out of four different substrate thermoplastics...
Aim of the research work is to determine the influence of thermo-mechanical stress on different assembly variants on the reliability of the micromechatronic system by thermo-mechanical stress analysis with combined simulation of the assembly. Therefore, four different assemblies are examined each on four different substrates, two substrate materials for MID and two flexible substrates. The frame of...
Mobile learning exposes learning to the natural environment. If this environment is large, the learners have to navigate to find the learning objects or to explore the environment. Current mobile learning systems provide only minimal navigational support. Prior studies report that conventional pedestrian information systems are not suited to mobile learning, as the learners focus too much on the navigation...
Mobile learning has a lot of potential for supporting learning in situations such as in a museum, at a tourist sight or when exploring biological phenomena at a riverside. There learners can interact with their environment and still make use of the advantages of computational power. However, we have found many of such projects hindered by placing the technology too much in the focus of the learner...
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