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The high temperature storage test (HTST) was conducted on the SnAgCu/Fe-Ni solder joints. The microstructural evolution during aging at 125°C was observed by both Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM). During the reflow process, FeSn2 layer and rod-like (Cu,Ni)6Sn5 grains were formed. During the aging at 125°C, dispersed (Cu,Ni)6Sn5 with two distinct morphologies...
PbTe nanopowders with different morphology were prepared by a simple chemical synthesis. Similar cubic nanoparticles have been successfully synthesized by using Pb(NO3)2 and Na2TeO3 as the precursors, and NaBH4 as the reductant. The single PbTe phase is confirmed from XRD pattern, and obvious width of XRD peaks occur. The size of powders is distributed from 20nm to 70nm in a typical process according...
TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring...
The current gold standard method of Malaria diagnosis relies on the blood smears examination. The method is labor-intensive, time consuming and requires the expertise for data interpretation. In contrast, Raman scattering from a metabolic byproduct of the malaria parasite (Hemozoin) shows the possibility of rapid and objective diagnosis of malaria. However, hemozoin concentration is usually extremely...
Transmission electron microscopy (TEM) observations were carried out to investigate the microstructural evolution of SnBi/single crystal (100) Cu interface during reflow and solid-state aging process. It was found that there were two kinds of IMCs, Cu6Sn5 and Cu3Sn, at the interface after reflow. The Cu3Sn grains grew along [100] direction of Cu with columnar morphology. During aging, new triangle...
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