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In technology of electronic packaging, demands of miniaturization and high-density in electronic systems has sustainably grown. Therefore, it have been required to develop the technology of three dimensional (3D) stacking using through silicon via (TSV) Technology. The TSV technology is an interconnection method by filling an electric conductive material in via hole after via formation. Cu as a filling...
Nanoimprint lithography (NIL) offers high precision patterning of structures as small as 50 nm using wafer-based or roll-to-roll process platforms, however current resist systems offer little functionality. We developed hybrid UV-NIL resists containing up to 90 wt. % nanoparticles with excellent optical transparency for direct patterning of device structures including a readily scalable print, lift,...
While discrete laser diodes may be evacuated and sealed on single die level using small metal TO packages like TO housings, it is obvious that high volume production for mobile applications requires a much more economical and small factor solution for the realization of transparent optical packages. We present here a solution that realizes glass packages with vertical emission window for laser diodes...
NANIUM's Fan-Out Wafer-Level Packaging technology WLFO (Wafer-Level Fan-Out) is based on embedded Wafer Level Ball Grid Array (eWLB) [1]. Since it's invention almost 10 years ago, it became the leading technology for Fan-Out Wafer-Level packages. The WLFO technology is based upon the reconstitution to wafer format of semiconductor dies or other active / passive components separated by mold compound...
The light efficiency of high brightness LED was improved with TiO2-nanoparticle-mixed encapsulant in this study. Well-dispersed TiO2 nanoparticles with size of 2 – 6 nm was synthesized by lowering pH of reaction solution. The well-dispersed TiO2 nanoparticles were mixed with encapsulant and the light efficiency of LED was dependent on the dispersion of TiO2. The weight percentages of the TiO2 nanoparticles...
Dynamic change in distribution of strain generated in Si under a pad electrode was measured during ultrasonic ball bonding by using newly developed Si strain sensor. The sensor was designed to be able to determine strains in the directions normal and parallel to the surface. Bonding of Cu and Au was measured. It was clearly observed that the position of the largest compressive strain moved from the...
Recently, the eco-friendly vehicles such as Hybrid Electric Vehicle (HEV) and Electric Vehicle (EV) have been spotlighted. EV has power semiconductors which generate a lot of heat. So, the power semiconductors have to guarantee reliability because it is driven at high temperature. Furthermore, it was able to be driven at a higher temperature by developing the semiconductor devices such as SiC and...
The paper deals with a new technique for deviation of atherosclerotic plaque. There are two plaque types: The yellow and white plaque. The white plaque is hard, fibrous and dimensionally stable. The yellow plaque is soft with high-cholesterol ratio and dimensionally instable. Every hit with a medical tool can generate a critical medical case, because the plaque can be rapture and the plaque particles...
Many process steps in semiconductor manufacturing and packaging benefit from pristine surface preparation, such as descuming of photoresist, removal of native oxides, and surface activation. One particularly important surface process is the preparation of surfaces prior to copper plating. New technologies such as Copper Pillar and TSV plating for micron-scale interconnects are particularly challenging...
Growing demand for bandwidth in datacom optical links and for high performance computers (HPC) recently led to the development of new optoelectronic modules based on silicon photonic integrated circuits (PIC) [1]. One of the intrinsic capabilities of this technology is the scalability in terms of aggregated data rate, due to the possibility of combining space division multiplexing (SDM), wavelength...
Fraunhofer IZM and Technische Universität Berlin in a collaboration show a versatile assembly platform for electro-optical and micro-optical components made from laser-structured thin glass with sizes of 18 × 24 inches (450 × 300 mm2) and larger for economical rapid prototyping as well as automated serial production.
This paper reports an Electronic System for application in biological analysis, especially in the detection of Infectious Disease. This system consists of a credit card size circuit that we have named “Lab-On-Card” or “LOC”. It is composed of three parts: (1) a tube, as a biological sample holder, containing the lyophilized reagents; (2) a Thermoelectric Module based on Peltier effect as a heating...
Sweat carries valuable information about our physiological and cognitive status. Measurement of various biomarkers in sweat provides a pathway for the assessment of fatigue or cognitive ability, disease, or even physical conditions such as blood glucose or hydration levels for individuals [1]. There has been a significant interest in developing a non-invasive, wearable sensor platform to facilitate...
This paper presents a washing reliability study of passive UHF RFID textile tags with three different coating materials. The tag antennas were fabricated by brush-painting silver ink on a 100 % cotton fabric. After attaching the ICs, the ready RFID tags were fully coated with three different protective coating materials: regular textile glue, epoxy coating, and silicone rubber. The coated tags were...
We have developed a strain gauge sensor to measure two axial dynamic strain and temperature evolution during ultrasonic flip-chip bonding. The sensor detects strain from change in resistance due to the piezoresistance effect of Si and temperature from change in current-voltage characteristics of pn-junction. The spatial resolution of the sensor is 20 µm. Au planar microbumps were used for the measurement...
We demonstrate a novel micro-welding process in which laser-generated stress waves produced close to the bonding site assist in the formation of direct metal-metal bonds. The process has been used to attach copper-bumped silicon flip-chips to silver-metallized substrates. De-bonding tests were used to study qualitatively the resulting chip-substrate bonds. It was found that generally the copper-silver...
In order to facilitate the evaluation the quality of layer compositions in terms of reliability, a new, non-destructive test method will be proposed in this paper. The new test method combines finite element simulations with creep testing. The advantage of this new method is that it gives a closer representation of the actual use conditions of the later device. This makes it easier to link results...
In recent years 12″ wafer level packaging has evolved from development to actual production with the eWLB product as the main example. To facilitate this, new encapsulation processes and dedicated equipment have been introduced into the market. In addition, also the wafer level package itself is evolving. Old package designs are often over-molds with thick mold caps obtained by compression molding...
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