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For biomedical electronics the compatibility to the biological environment should be well-considered. Therefore this paper evaluates dispensed carbon nanotubes (CNT's) on polyimide (PI) foil for conductive tracks and electrodes for flexible, biomedical applications. A CNT based ink is investigated regarding biocompatibility, flexibility, conductivity and suitability for electrode materials with contact...
Nowadays, electronic circuits based on wide range of organic materials with semiconductor properties are still perceived as a somewhat unconventional design approach and fabrication technology. However, it could potentially deliver many significant advantages. Materials for organic electronics are typically lighter, flexible, easier to handle and less expensive in comparison with traditional inorganic...
This paper presents a washing reliability study of passive UHF RFID textile tags with three different coating materials. The tag antennas were fabricated by brush-painting silver ink on a 100 % cotton fabric. After attaching the ICs, the ready RFID tags were fully coated with three different protective coating materials: regular textile glue, epoxy coating, and silicone rubber. The coated tags were...
While discrete laser diodes may be evacuated and sealed on single die level using small metal TO packages like TO housings, it is obvious that high volume production for mobile applications requires a much more economical and small factor solution for the realization of transparent optical packages. We present here a solution that realizes glass packages with vertical emission window for laser diodes...
Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various...
We have developed a strain gauge sensor to measure two axial dynamic strain and temperature evolution during ultrasonic flip-chip bonding. The sensor detects strain from change in resistance due to the piezoresistance effect of Si and temperature from change in current-voltage characteristics of pn-junction. The spatial resolution of the sensor is 20 µm. Au planar microbumps were used for the measurement...
We demonstrate a novel micro-welding process in which laser-generated stress waves produced close to the bonding site assist in the formation of direct metal-metal bonds. The process has been used to attach copper-bumped silicon flip-chips to silver-metallized substrates. De-bonding tests were used to study qualitatively the resulting chip-substrate bonds. It was found that generally the copper-silver...
In technology of electronic packaging, demands of miniaturization and high-density in electronic systems has sustainably grown. Therefore, it have been required to develop the technology of three dimensional (3D) stacking using through silicon via (TSV) Technology. The TSV technology is an interconnection method by filling an electric conductive material in via hole after via formation. Cu as a filling...
The indoor air quality sensing indicators introduce people to novel concepts necessary for being aware and analysing of the indoor environments and help them to recognise and address indoor environmental quality problems in the building environments and the link to health, comfort and productivity of the occupants.
Co-P films with thicknesses of 3.5 and 12.5 µm were used as metallization in Sn-Ag-Cu/Co-P ball grid array solder joints. The solder joints were annealed at 150°C up to 1000 h. The growth and mechanical properties of interfacial intermetallic compounds (IMCs) in the Sn-Ag-Cu/Co-P joints were studied, and the influence of Co-based IMCs on the shear strength of the Sn-Ag-Cu/Co-P joints was analyzed...
In this work, we present thermal imaging and analysis of a silicon photonic optical network unit (ONU) for next generation passive optical networks (NG-PONs). A high-speed thermal camera is used to capture both the dynamic and steady-state temperatures of the photonic integrated circuit (PIC) and electric integrated circuit (EIC) at the core of the ONU. The dynamic temperature measurements of the...
Flexible device can be viewed as the ultimate extension of 3D packaging, providing new functions and advantages. In this work, we propose a new packaging development on tunable curvature of Complementary Metal Oxide Semiconductor (CMOS) image sensors and propose new optical functions. Based on a mechanical study, Tunable Curved Focal Plane Array (T-CFPA) prototypes have been realized. Our investigations...
Based on a simple process referred to as ultimate-thinning-and-transfer-bonding (UTTB), this paper shows that the high-frequency performance of advanced CMOS technologies can be combined with mechanical flexibility and transparency. The invariance upon thinning, transfer and flexure of both DC and RF CMOS electrical characteristics is demonstrated. Specific to high power RF applications, the complete...
In order to facilitate the evaluation the quality of layer compositions in terms of reliability, a new, non-destructive test method will be proposed in this paper. The new test method combines finite element simulations with creep testing. The advantage of this new method is that it gives a closer representation of the actual use conditions of the later device. This makes it easier to link results...
Recent progress in wafer level packaging technologies has enabled high power flip chip (FC-LEDs) for direct assembly on printed circuit boards (PCB) for general and automotive lighting applications. Based on LEDs with a light emitting area of 0.5mm2 arrays for miniaturized modules are realized. The individual LEDs are single addressable, the pitch is solely 790µm and the gap between the light emitting...
In this study, we investigated the deformation of power electronics assemblies during passive and active heating. The power devices were diodes and IGBTs and the substrates used were DCB and PCB. The components were die-bonded with two types of electrically conductive adhesive.
3D printing offers the possibility to fabricate parts and products in a cost-effective, high-throughput, mass-customisation and energy efficient manner across a diverse range of applications. This paper details the key challenges in adopting 3D printing in electronics manufacturing and sets the design and modelling approaches best suited to carry out assessment and optimisation of performance, quality...
Manufacturing in all sectors has undergone dramatic changes as a result of globalization and the introduction of IOT. Globalization and IOT have brought significant challenges, as well as opportunities to the supply chain of large enterprises (for example Ericson, Alcatel, and HP). There has been an infrastructure change from a single integrated process performed within the boundaries of the traditional...
In recent years 12″ wafer level packaging has evolved from development to actual production with the eWLB product as the main example. To facilitate this, new encapsulation processes and dedicated equipment have been introduced into the market. In addition, also the wafer level package itself is evolving. Old package designs are often over-molds with thick mold caps obtained by compression molding...
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