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In this study, a steady and comparatively smooth Ni-P coating on the surface of diamond/Al composite substrate was fabricated by electroless plating, which can outstandingly improve solderability of the composite. By controlling the deposition time, we obtained the growth curve of the Ni-P coating, and as a result we can adjust the thickness of the coating. The solderability was tested by soldering...
In the electronic industry, the packaging substrate is mainly made of copper, hence the interfacial reaction between solder and Cu during the soldering and the service process of solder joint always draw peoples' attention. In this study, a Sn3.8Ag0.7Cu1.5Sb3.0Bi0.15Ni (tentatively named as SACSBN) solder paste was evaluated on Cu substrate with comparison to Sn3.0Ag0.5Cu (SAC305). The effects of...
In this study, interfacial reaction of SAC/FeNi solder joints is investigated, and the Cu-rich IMC was clarified according to scanning electron microscopy (SEM) and transmission electron microscopy (TEM) observations. At SAC/27Fe73Ni interface, Cu rich IMC is rod-like dispersing in the solder. On the other hand, at the interface of SAC/55Fe45Ni solder joints, Cu rich IMC has an island-shape. From...
In this study, phase transformations at the interfaces between two nearly mutually insoluble elementary substances, In-48Sn solder and Cu, were investigated during serial solid-state aging process. The reversible phase transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds were observed, which are extremely rare to occur in one and the same system. The corresponding interfacial reactions were...
In this study, phase transformations at the interfaces between two nearly mutually insoluble elementary substances, In-48Sn solder and Cu, were investigated during serial solid-state aging process. The reversible phase transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds were observed, which are extremely rare to occur in one and the same system. The corresponding interfacial reactions were...
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