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Thermally conductive adhesives (TCAs) have been widely used in electronic packaging industry, such as for chip packages in smart phones and high-power LED lightings, as they combine the workability of polymer resins with the high thermal conductivity of fillers[1−4]. The polymer resins endow adequate adhesion strength and provide sufficient mechanical robustness. The thermally conductive fillers mainly...
High power phosphor-converted white light emitting diodes (pc-WLEDs) are proposed to substitute the traditional lighting sources owing to their benefits in high luminous efficiency, low power consumption, long lifetime and environmentally friendly. Currently, the most effective approach to fabricate a pc-WLED package is to cover the phosphor/silicone composites on a blue LED chip using the deposition...
Heterostructures of carbon nanotube on graphene, CNT-graphene, with two graphene layers connected by a CNT normal to the graphene planes, are investigated using first-principle calculations, leading to computed density of states (DOS) and electron transmission spectra. Based on these results, the structure consisting of graphene and a (4,4) CNT is determined to be metallic while that of graphene and...
Mechanical impact or shock resulted from inevitably transport or usage of electronic equipment, may cause great stress and strain in the electronic package, even lead to the failure of electronic equipment, so it's of great significance to explore the mechanical behavior of electronic packaging under drop/impact. In all kinds of package, 3D System in Package with Through Silicon Via has become a hot...
The demand for large form factor Flip Chip Ball Grid Array (FCBGA) package has been increasing to meet the growing needs of high bandwidth network traffic. It is also well known that FCBGA packages are sensitive to external mechanical shock. The dynamic performance of electronics under mechanical loading, such as bending and shock conditions, has been an important factor in the quality and reliability...
Penta-graphene (PG) has a large ratio of surface to volume and an intrinsic quasi-direct band gap that may benefit for the application of semiconductor sensors. In order to investigate the adsorption behavior of nitric oxide (NO) molecule on the surface of PG, in this study, the adsorption energy, charge transfer and adsorption distance of NO at different locations of pristine and Al-doped PG are...
Chip scale package (CSP) as an advanced technology has been applied to LED lighting devices, besides electromigration (EM) in CSP under high current density has become a critical reliability issue for the future high density microelectronic packaging. In this paper, the thermal-electric-mechanical coupled analysis is performed by the flip-chip CSP LED multi-physical finite element model. Based on...
This paper designs a vertical-interconnect transmission structure which could be applied in PoP(Package on Package) package structure. In this model, Through Mold Via(TMV) transmission structure is utilized to realize inter-side and stacked-model interconnection. A quasi-coaxial via cluster connected to the strip line is designed for vertical RF transmission. It was found that the center distance...
Influenced by the assembly accuracy of microwave modules, a gap often locates between two different components, such as metal cavity and LTCC substrate, which induces the discontinuity of microwave ground and resonation in millimeter wave band. These influences can be ameliorated by bonding a flexible transmission line between the two different materials, thus the voltage standing wave ratio and microwave...
Chemical mechanical polishing (CMP) performance influence the reliability of TSV process, because the wafer chip-to-chip vertical interconnections for the next process request the TSV wafer a flat surface without defects after CMP. The influence of ECD process to the CMP defects, further to the via-filling effect, was investigated. Thickness uniformity, top surface morphology and the grain orientation...
For comparing the stability and reliability of horizontal, vertical and flip LED chips, we carried on the high temperature and high current aging experiment towards to the three kinds of bare LED chips on our self-build online monitoring and accelerated life system. Most of samples shown stable performance during the entire experiment process, but there was only one flip LED chip whose illuminant,...
Recently, wearable electronic devices have drawn increasing attentions because of the merits of high flexibility and stretchability and could be used to sense tactility, vibration, and temperature. It has been widely used in the humanoid robotics, mobile phones, and physical/chemical sensors and even human body in the past few years. Therefore, it is essential to develop pressure sensors with high...
For the past few years, optical interconnects technology has been developed rapidly. At the same time, many problems and difficulties need to be solved immediately. There is a difficult problem in optical coupling that the coupling efficiency between fiber and slab waveguide is quite low. The coupling efficiency impacts the property of optical devices directly. The purpose of the paper is to design...
This paper presents a third order coupled bandpass filter using integrated passive device technology and SIR architecture. The filter is based on the semiconductor wafer IPD process, using thin film technique and photolithography technology, combined with the advantages of high harmonic suppression of the SIR. Compared with passive device process such as LTCC (low temperature co-fired ceramic), this...
Chip-scale scalar atomic magnetometers (CSAMs) generally measure the magnitude of the magnetic field independent of orientation. In most cases CSAM can achieve high sensitivity (pT/Hz1/2) in the magnetic field ranged from 1000nT–5000nT. In our previous presentation in ECTC 2016, CSAMs were demonstrated with a considerable sensitivity of 40pT/Hz1/2 in the magnetic field of 4000nT. However, some applications...
Electromigration (EM) of solder joints in microelectronic devices have become a critical reliability issue due to the continuous miniaturization and requirements for enhanced performance of the devices. At present, besides EM, thermomigration(TM) has been regarded as another reliability concern as it has been found to accompany EM in flip chip solder joints. Both EM and TM effect are the main factors...
Since solder joints may work in corrosion media, corrosion products can be easily formed and then enhance current transport resistance in practice. It is of great importance to study the corrosion behavior of SAC305 solders added with different nanoparticles. The electrochemical corrosion behaviour of Sn-3Ag-0.5Cu alloys with the addition of nano-Ag3Sn and nano-Cu3Sn was investigated in 3.5 wt. %...
the increasing demand for light emitting diodes (LEDs) has been driven by a number of application categories. The construction of LEDs is somewhat similar to microelectronics, but there are functional requirements, materials, and interfaces in LEDs that make their failure modes and mechanisms unique. In this paper, the main failure modes and mechanisms of LED device and its driving module are investigated...
The paper used Sn-58Bi interconnects to perform the thermal aging treatment under different times, namely one day, three days, fine days, seven days, fifteen days under 120°C. Then the tensile experiment was launched, the mechanical properties of solder joints were analyzed by looking at the joint defect, fracture and the IMC layer with SEM, combining with the tensile properties and fractograph analysis...
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