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Lower energy consumption, higher conversion efficiency, and longer life lead to a widely use of light emitting diode (LED) in illumination applications. However, the long product life makes it difficult to do reliability test due to the long time it cost. Generally, the reliability performance of the LED is evaluated by thermal cycling and thermal shock. In this paper, a new reliability testing method...
Jet dispensing is one of the key technologies in LED packaging as the consistency of the dispensed volume can directly affect the LED color and quality. Studying the dynamics of silicone-phosphor during the jet dispensing process is of great value. In this paper, a multi-physical model was developed and verified by the experiments. The silicone-phosphor thread profile during the jet dispensing process...
In this paper, the growth behavior of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system during the ultrasonic-assisted transient liquid phase soldering were investigated under various ultrasonic bonding time. Asymmetrical growth of the interfacial Cu6Sn5 was observed in the Cu/Sn/Cu solder joints, i.e., the Cu6Sn5 near the side of cavitation erosion grew randomly, while the Cu6Sn5 near...
In this paper, we study the electrical performance of a flip-chip ball grid array package assembled with a alloy steel stiffener on top. The metal plate on the chip package could create the cavity resonance at sensitive frequency bands, thus introducing couplings and interferences among high speed digital signals and analog or radio frequency signals. It affects the signal transmission, such as impedance...
This paper presents a high-gain millimeter-wave array antenna highly integrated on a single organic chip package. The multi-phased beam steering capability is enabled to reduce multipath fading and over-the-air applications around 30GHz. To improve antenna bandwidth, gain and radiation efficiency, a dual-patch antenna is built on a superstrate structure. A number of design attributes, such as patch,...
For revealing the influences of thermomigration effect (TM) on the creep properties of interconnecting solder joints in electronic packaging industry, the creep behavior of Cu/Sn0.7Cu/Cu solder joints were researched under temperature gradient of 1043°C/cm and isothermal temperature of 100°C(median temperature) with different shear stress, respectively. It is approved that the creep lifetime of the...
The purpose of this paper is to study the temperature effect on the Print Circuit Board (PCB) and the solder joints in the vehicle under working condition of the engine. Thermal-stress test has been used to evaluate the reliability or fatigue life of the PCB using commercially available Finite Element Analysis software, ANSYS. The thermal deformation distribution of the PCB and stress of the solder...
RF signal is ease to be interfered, which makes the signal of transmitting and receiving impure to impact on wireless communication. It is not to be ignored for interfering between transceiver signals in package of transceiver, thus, insulating enough must be taken. In addition, the mount of noise introduced through a main interference source being from contribution of digital signal continuously...
Dry etching process are some of the most familiar MEMS technology. In this paper, we study the rate enhancements observed through operation of the power of plasma source and the oxygen flow rate in a single step at low temperature for high dose implanted photoresist removal.
Power converter is going in the direction of the high power density. Aimed at the trend, a 1200V/300A planar double-side cooling IGBT module has been designed, packaged. Comparing with conventional IGBT module, Parasitic inductance is reduced by 43.26%; Thermal resistance is 26.7% lower; Turn-on time and turn-off time are decreased by 35% and 15.8% respectively; The total power losses are reduced...
Pb-free silver pastes based on SnO-B2O3 glass frits were synthesized and used for the front-contact electrodes of crystalline silicon (c-Si) solar cells. First, four kinds of SnO-B2O3 glass frits with different amounts of SnO were synthesized by a melt-quenching method, and four Ag pastes based on these glass frits were prepared correspondingly. Then, Ag pastes were printed on c-Si solar cells and...
In the past few years, organic film prepared on the silicon (Si) surface has become attractive owing to the wide range of potential application, low cost and good performance. In this paper, perfluorinated organic film was prepared on the Si surface in aqueous solution using one-step dipping method. On the Si surface, 4-nitrobenzene diazonium (NBD) tetrafluoroborate was firstly reduced with the presence...
A hierarchically structured Cu-Ni-P film fabricated via one-step route of electroless plating is reported. The morphology of deposits can be controlled by adjusting the additive in electrolyte. Due to the synergistic crystalline modification of polyethylene glycol (PEG), Janus Green B (JGB) and Cl−, the as-prepared Cu-Ni-P film exhibits pine-like architecture, about 2 µm in height and 1.5µm in root...
Driven by the pressure of environment protection and cost reduction, direct plating as a new alternative process had been used to replace the conventional electroless copper in some factories. It is necessary to realize the potential reliability problems when using this completely plating method. An internal circuit open failure case in PCB with direct plating using conductive polymers was studied...
Thermal cycling is typical working environment of electronic chips due to electronic equipment power on-offs and thermal excursions. Accelerated thermal cycling is widely employed to strictly examine the electronic products for aerospace usage to simulate the actual thermal environment throughout the service life. In this study, the effect of thermal cycling to mechanical property of Sn-3.0Ag-0.5Cu...
The ESD failure mechanism of integrated circuits in a 0.11µm CMOS process was investigated experimentally in detail. The leakage current was presented through I–V measurements, some hotspots were observed on the failed chips when ESD occurring. The study suggested two failure modes in the experiments. One was defined as thermal ESD failure, and the large current between one pad and another pad can...
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