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In this study, a steady and comparatively smooth Ni-P coating on the surface of diamond/Al composite substrate was fabricated by electroless plating, which can outstandingly improve solderability of the composite. By controlling the deposition time, we obtained the growth curve of the Ni-P coating, and as a result we can adjust the thickness of the coating. The solderability was tested by soldering...
In the electronic industry, the packaging substrate is mainly made of copper, hence the interfacial reaction between solder and Cu during the soldering and the service process of solder joint always draw peoples' attention. In this study, a Sn3.8Ag0.7Cu1.5Sb3.0Bi0.15Ni (tentatively named as SACSBN) solder paste was evaluated on Cu substrate with comparison to Sn3.0Ag0.5Cu (SAC305). The effects of...
In this study, phase transformations at the interfaces between two nearly mutually insoluble elementary substances, In-48Sn solder and Cu, were investigated during serial solid-state aging process. The reversible phase transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds were observed, which are extremely rare to occur in one and the same system. The corresponding interfacial reactions were...
Owing to interacting with the living tissue directly, the electrode-tissue interface largely determines the performance of the whole bioelectronics devices. The miniaturization of biomedical electronic components requires interface materials to possess properties including excellent electrical performance, good biocompatibility and compatibility with microelectronic fabrication process. Considering...
In this study, phase transformations at the interfaces between two nearly mutually insoluble elementary substances, In-48Sn solder and Cu, were investigated during serial solid-state aging process. The reversible phase transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds were observed, which are extremely rare to occur in one and the same system. The corresponding interfacial reactions were...
The interfacial microstructure and Kirkendall voids between eutectic SnIn and polycrystalline Cu substrate was investigated after reflowing and long-term solid-state aging process. The results indicated that two crystal-structure IMC species: Cu(In, Sn)2 phase existing at the solder side and Cu2(In, Sn) phase locating at the Cu side, among which Cu2(In, Sn) phase with two different morphologies, the...
TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring...
Transmission electron microscopy (TEM) observations were carried out to investigate the microstructural evolution of SnBi/single crystal (100) Cu interface during reflow and solid-state aging process. It was found that there were two kinds of IMCs, Cu6Sn5 and Cu3Sn, at the interface after reflow. The Cu3Sn grains grew along [100] direction of Cu with columnar morphology. During aging, new triangle...
The microstructures of SnBi/Cu interconnect after reflow and its evolution during solid-state aging at 393 K were investigated using transmission electron microscopy (TEM). It was found that after reflow there were two kinds of intermetallic compounds (IMCs) - Cu6Sn5 and Cu3Sn in solder joint. Above these IMC layers there was a Bi-rich layer which consisted of discontinuous Bi particles. During solid...
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