The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Interposer-based 3D ICs (or known as 2.5D ICs) have been seen as an alternative approach to true 3D stacked ICs, which mount multiple dies on a silicon interposer and route signals between dies by the interconnects in the interposer. However, the floorplan of dies on the interposer and the signal assignment for macro-bumps and TSVs will largely impact the wirelength of the interconnects in a 2.5D...