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This paper presents the relations between processing, microstructure and mechanical reliability of copper pillar bumps (CuPi). Two sets of samples were manufactured: Cu/SnAg and Cu/Ni/SnAg with diameters between 15 and 20 µm. From the microstructure point of view: at these dimensions and for simulated reflows, up to 5, intermetallic compounds (IMC) follow a classical power law with a time exponent...
This paper presents a new test protocol aimed at accurately determining the temperature of 3D electronic circuits as well as their heat distribution. It is based on AC electrical measurements coupled with InfraRed Lock-In Thermography (IR LIT) measurements. The circuit temperature is assessed thanks to AC resistance measurements and the Temperature Coefficient of Resistance (TCR) of metallic layers...
This paper presents, for the first time, an electromigration study for a hybrid bonding-based integration for advanced image sensor applications. This work demonstrates that the hybrid bonding module has no impact on the electromigration resistance of the present integration. The weakest link is always the BEoL level. There is no hybrid bonding-related failure.
An accurate knowledge of the phenomenon is required to develop a predictive modeling of the electromigration failure. Thus, a hitherto unseen SEM in operando observation method is devised. The test structure with “high density” through silicon vias (TSV) is tested at 623K with an injected current density of 1MA/cm2. Regular shots of micrographs inform about the voids nucleation, forced in copper lines...
Failure analyses on uinsert technology used for 2.5D stacking are carried out after 1000 hours of damp heat test on nickel, copper and gold-nickel μinserts. We show that nickel μinserts are prone to delamination when the force applied on the reported die during bonding process is not homogeneous or lower than an optimal value. After the test, one out of eight tested gold-nickel μinserts is subject...
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