The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Additive manufacturing is a fast-growing technique due to its ability to fabricate complex objects layer by layer from a preprogrammed digital model. Additive manufacturing can greatly enhance the heat exchanger manufacturing field, as it makes possible the fabrication of complex heat exchanger designs that are challenging to fabricate using conventional methods. In the present work, an air-to-water...
The control of diamond nucleation and the early stages of diamond growth are essential for control of the diamond properties that are sensitive to or directly depend on the film anisotropy, grain size, and microscopic voids in the film. This phenomenon particularly affects the thermal conductivity of thin diamond films. Measuring the thermal conductivity/thermal diffusivity of material like diamond...
Consistent and wide-ranging material property data are needed for microelectronics encapsulants for the determination of mechanical design, reliability assessment, and process optimization of electronic packages. Since, the vast majority of contemporary underfills used are epoxy based, they have the propensity to absorb moisture, which can lead to undesirable reductions in their mechanical and adhesion...
The energy consumption in a typical data center is rising day by day to meet the increasing demand of high compute servers resulting in high energy costs. In typical data centers, almost half of the IT energy is dedicated to cooling of the IT server racks. Hybrid cooling technology as an approach to minimize the power consumption uses of water or water based fluid to cool a high heat generating component...
The present server under study with defined architecture is constructed in such a way to ensure the minimal time during the maintenance. Server consists of two trays, top tray and bottom tray. Bottom tray consists of the mother board which holds the Skylake processor dissipating 165W as maximum TDP and DIMMs (DDR4 / AEP) along with FPGA and BMCs. Top tray is a configurable tray in four variants. The...
Data center cooling presents unique challenges to reduce global energy consumption and fluid inventory. The current work addresses these challenges by employing a thermosiphon system using two-phase cooling which improves the system efficiency through a drastic increase in heat dissipation ability. The latent heat transfer is more effective than its sensible heat counterpart. The system performance...
There is often thermal challenge to keep Central Processing Unit (CPU) temperature within its design specification for rack server systems with air cooling solution, due to the growing demand for higher CPU performance and the ever-increasing CPU thermal design power (TDP). This paper provides an approach to enhancing system air cooling capability of servers mounted on a rack, addressing the challenge...
An experimental study was conducted to examine the behavior of a refrigerant two-phase system for cooling multiple servers at differing vertical locations within a standard data center rack. In such racks, the vertically stacked servers may operate at different utilization levels and hence may have differing power dissipations. Furthermore, these distinct power dissipations may occur at differing...
Due to the nature of their operations, electronic data centers are highly dynamic in their computational load handling, and concomitantly in the heat generated by various servers inside the data center. In the absence of physics-based control algorithms, air-conditioning systems are typically operated through conservatively pre-determined set points, thereby resulting in sub-optimal electricity consumption...
This paper outlines evaporative flow boiling results in custom smooth and internally-grooved tube cold plates with U-bends. Heat transfer data, captured with an infrared camera, is analyzed for liquid-vapor HFE-7100 flow in horizontal 9mm channel diameter cold plates, with mass fluxes from 75–250 kg/m2s, heat fluxes from 0–18 kW/m2, and vapor qualities approaching unity. This data is compared to a...
A wettability patterned surface has been developed to manipulate nucleation boiling in a micro fluid flow channel. The wettability patterns was fabricated by using hydrophobic dots on hydrophilic surfaces which form non-wetting islands and wetting network. The hydrophobic hexagon dots with a side length of 30μm and pitch distance 60μm are fabricated with Teflon (Teflon AF 400s2-100-1, DuPont) which...
Electronic enclosure design and the internal arrangement of PCBs and components influence microclimate inside the enclosure. This work features a general electronic unit with parallel PCBs. One of the PCB is considered to have heat generating components on it. The humidity and temperature profiles near the surface of PCBs depend on various factors like inter-PCB spacing, controlled opening size, and...
Data centers concern not just energy usage, but also other important overall considerations such as the actual computational work, the energy efficiency and the performance of servers. The server, as one of the key ingredients of a data center, plays an increasingly crucial role in contributing to the overall energy use, especially in cases where the efficiency of the infrastructure has been optimized...
Power saving techniques and associated thermal management are inevitable for present day smartphones. Smartphones employ thermal feedback (temperature at key locations) based dynamic power management strategies to maintain the system temperature in the desired range. It is challenging to simulate the thermal behavior of such a system as running a computational fluid dynamics system with control logic...
A numerical study was performed to obtain insight into conduction/convection conjugate heat transfer processes during a typical experiments performed at the micro scale. The experimental work of Wang et al. [1] was used as a baseline to quantify such effects. It consisted of a 225 μm × 18.5 mm × 1.5 mm microchannel with a pillar, which had jet slits. Commercially available software package, Star CCM+,...
In the past several decades, the increasing performance of integrated circuits has put increasing demands on thermal management solutions. The thermal interface resistance of a typical electronics package can often comprise the majority of the total thermal resistance. While much effort has been put into developing high conductivity materials for thermal interface material (TIM) applications, in practice...
For the first time, an integrated thermal characterization scheme that generates a full two-dimensional temperature map of GaN lateral devices has been developed. Through calibration and integration of micro-Raman thermometry, thermoreflectance thermal imaging, and infrared thermography, the accuracy of these techniques has been demonstrated to significantly improve, in addition to the complete thermal...
The wide band-gap (WBG) semiconductor electronics such as silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular in power electronics applications due to their excellent functionality at higher operating temperatures, powers, frequencies and in high radiation environments compared to Si devices. However, the continued drive for higher device and packaging densities has led to extreme...
This study describes the interfacial thermal performance of low melting temperature alloys (LMAs) for the application as thermal interface materials (TIMs). The thermal performance of LMAs evaluated in terms of accelerated life cycle testing, which included highly accelerated stress testing (HAST) at 85oC and 85%RH and thermal cycling from −40°C to +125°C. Three lead and cadmium free low melting alloys...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.