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Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.
Provides an abstract for each of thepresentations and a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings.
Changing expectations for higher education, combined with greater competition for resources, are creating a need to explore and develop both immediate, and long-term sustainable solutions that address the effectiveness and costs associated with higher education. Here in the U.S., reductions in state support at public universities have resulted in increases in that portion of the costs that are passed...
The use of CVD diamond films for electronic thermal management is quickly being realized as a viable application in high-power and high-temperature electronics, owing to the exceptional thermal properties of diamond and the recent advances in diamond CVD growth technology. In this study, a thick (~100 μm) CVD diamond film was grown on a 75-mm wafer consisting of AlGaN/GaN high electron mobility transistor...
In the present study performance of air-cooled cross flow microchannel heat exchanger is analysed experimentally with various metal oxide type nanofluids. Types of the nanoparticles and their particle size are TiO2 (30 nm, 50 nm), MgO (20 nm, 40 nm), ZnO (10–30 nm, 35–45 nm, 80–200 nm), SiO2 (20–30 nm, 60–70 nm), NiO (10–20 nm) and Fe3O4 (15–20 nm). Zeta potential measurement is employed for the stability...
The control of diamond nucleation and the early stages of diamond growth are essential for control of the diamond properties that are sensitive to or directly depend on the film anisotropy, grain size, and microscopic voids in the film. This phenomenon particularly affects the thermal conductivity of thin diamond films. Measuring the thermal conductivity/thermal diffusivity of material like diamond...
Thermally conductive polymer composites, in particular those composed of polymers and carbon-based nanomaterials, are promising for thermal management in electronic devices because they offer high thermal conductivity at low filler loading. The effective thermal properties of these composites exhibit high variability that depend on the topological arrangements and morphological characteristics of...
Mass and heat transfer are well studied fundamental engineering principles with established relationships between them. Owing to experimental errors and uncertainties, heat transfer studies have been primarily conducted using numerical tools and analytical models. By studying mass transfer behavior, heat transfer characteristics can be obtained through existing correlation. Through this study we aim...
Additive manufacturing is a fast-growing technique due to its ability to fabricate complex objects layer by layer from a preprogrammed digital model. Additive manufacturing can greatly enhance the heat exchanger manufacturing field, as it makes possible the fabrication of complex heat exchanger designs that are challenging to fabricate using conventional methods. In the present work, an air-to-water...
This paper presents a method for determining thermal conductivity of film samples using the non-contact mode scanning hot probe technique at probe-to-sample distances such that Fourier law heat conduction across the air gap occurs. A method for calibrating non-contact thermal exchange parameters between probe and sample using a single reference sample is proposed and the obtained value of sample thermal...
Consistent and wide-ranging material property data are needed for microelectronics encapsulants for the determination of mechanical design, reliability assessment, and process optimization of electronic packages. Since, the vast majority of contemporary underfills used are epoxy based, they have the propensity to absorb moisture, which can lead to undesirable reductions in their mechanical and adhesion...
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