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3D integration is one of the most promising solutions for the scaling of future integrated circuits (ICs). Nevertheless, the 2D metal wires and 3D through silicon vias (TSVs) are frequently performance bottlenecks of 3D ICs, due to their high capacitive crosstalk, which can be reduced by a coding approach. In this work we show that existing TSV crosstalk avoidance codes (CACs) are impractical for...
For efficient design of digital circuits operating under wide range of voltage voltages, RTN model incorporating the dependencies of both the gate area and supply voltage are required. In this paper, we characterize the delay distributions due to RTN under different supply voltages. The delay distributions are then converted to threshold voltage distributions by statistical analysis. Measurement results...
Aèsiraci-Networks-on-Chip are vulnerable to a variety of manufacturing and design factors making them susceptible to disparate faults that cause corrupted message transfer or even catastrophic system failures, due to the central position of the NoC in the system. Therefore, a NoC system should be fault-tolerant to transient malfunctions or permanent physical damages. The terminology of fault tolerant...
An ultra-low power regulated charge pump system based on charge recycling between a tank capacitor and the charge pump output load capacitor is presented. The proposed circuit is implemented using a 55 nm UMC High Voltage CMOS technology with a power supply of 1.2V. Simulation results show a maximum current reduction of about 38% compared to a conventional regulated charge pump system. Rise time until...
Through Silicon Vias (TSVs) are crucial elements for the reliable operation and the yield of three dimensional integrated circuits (3D ICs). Resistive open defects are a serious concern in TSV structures. In this paper, a post-bond, parallel testing technique is proposed for the detection and location of resistive open defects in TSVs, which is based on easily synthesizable all digital testing circuitry...
Approximate computing introduces a new era of low-power and high-speed circuit designs. Instead of strict accurate computation, relaxed requirements might increase performance and reduce power consumption with a simplified or inaccurate circuit. One of the recent remarkable research efforts is the accuracy-configurable approximate adder designs, which can gracefully operate in both approximate (inaccurate)...
The Internet of Things revolution requires long-battery-lifetime, autonomous end-nodes capable of probing the environment from multiple sensors and transmit it wirelessly after data-fusion, recognition, and classification. Duty-cycling is a well-known approach to extend battery lifetime: it allows to keep the hardware resources of the micro-controller implementing the end-node (MCUs) in sleep mode...
Performance slack in IoT applications is routinely exploited in sensor nodes to minimize power by aggressive voltage scaling. However, scaling voltage to sub-threshold levels causes severe degradation in performance and is prone to On Chip Variation (OCV). In contrast, Near Threshold Voltage (NTV) operation offers a good balance between performance loss, OCV and energy reduction and is promising for...
ASICs for Stochastic Computing conditions are designed for higher energy-efficiency or performance by sacrificing computational accuracy due to intentional circuit timing violations. To optimize the stochastic gate-level circuit behavior of a specific design, iterative timing analysis campaigns have to be carried out for a variety of chip temperature- and supply voltage-dependent timing corner cases...
We describe an analysis of the main process parameters variability involved in electrical and optical output characteristics of an optical sensor integrating a standard silicon-based NWell in p-epitaxial substrate photodiode and an UV/IR blocking interference filter. This study is done with TCAD simulation following a standard 0.18 μm high voltage CMOS technology fabrication process. The TCAD simulations...
Environmental temperature variations, as well as process variations, have a detrimental effect on performance and reliability of embedded systems implemented with deep-sub micron technologies. This sensitivity significantly increases in ultra-low-power (ULP) devices that operate in near-threshold, due to the magnification of process variations and to the strong thermal inversion that affects advanced...
Redox-based resistive switching devices can be switched between a high resistance state and a low resistance state in a reversible manner. An important requirement is the stable operation between these two states for a high amount of switching cycles. In this work the switching dynamics of these devices are investigated by means of device simulation. Hereby, we discuss the conditions for which a fading...
In digital logic circuits, unconstrained scan tests are known to evoke much higher switching activity than functional modes. To create test conditions which are as similar as possible to functional modes, today's ATPG tools have knobs to constrain the switching activity of the generated test to a user-defined functional (= lower) level. Two-dimensional system chips (SoCs) and three-dimensional stacked...
Memristors have extended their influence beyond memory to logic and in-memory computing. Memristive logic design, the methodology of designing logic circuits using memristors, is an emerging concept whose growth is fueled by the quest for energy efficient computing systems. As a result, many memristive logic families have evolved with different attributes, and a mature comparison among them is needed...
In this paper, we present a simple analytical delay model for memristive memory cells. The output voltage evolution is obtained analyzing the charge-flux dynamics when a voltage ramp is applied to the input. From this evolution, the propagation delay is calculated. The model is validated using the VTEAM memristor model for different input rise time values of the applied ramp. The proposed model can...
Ultra-deep sub-micron technology is shifting the design paradigm from area optimization to power optimization. In the context of Network-on-Chip (NoC) based design, energy consumption due to data transfer among network nodes is no longer negligible. Starting from the observation that, among the two brain hemispheres around 1 out of 106 synapses are active at the same time, in this paper we propose...
In this paper, we discuss the architecture exploration of a Neuromorphic Signal Processing Integrated Circuit using Precise Timing. This device is intended to fulfill the role of a Digital Signal Processor in the spiking domain, becoming an essential tool to Spiking Neuromorphic Sensors such as Dynamic Vision Sensors. Our approach is based on the use of Spiking Neural Networks with preset topology...
Application requirements along with the unceasing demand for ever-higher scale of device integration, has driven technology towards an aggressive downscaling of transistor dimensions. This development is confronted with variability challenges, mainly the growing susceptibility to time-zero and time-dependent variations. To model such threats and estimate their impact on a system's operation, the reliability...
As the importance of the thermal issues in the design of multiprocessor systems increases, it becomes mandatory to analyze the thermal effects and the thermal management techniques early in the design flow, ideally during the hardware emulation phase. Moreover, several scenarios (multiprocessor systems connected with photonic NoCs, 3D systems, etc.) demand a high accuracy during the thermal emulation...
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