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The following topics are dealt with: body network application; near-field telemetry; LED driver; MOSFET devices; SRAM circuit; light emitting diode; on-chip reference oscillators; CMOS optical receiver; ring oscillator delay; CMOS inverter; NMOS driver; digital DC-DC converter; low power switched capacitor; low power dual-mode pulse triggered flip-flop; VLSI architecture; and thin film transistor.
In this paper, a wireless telemetry using the near-field coupling technique with round-wire coils for an implanted pacemaker is presented. The proposed system possesses an external powering amplifier and an internal bidirectional microstimulator. Even with a low induced voltage, all the circuitries associated with the implantable stimulator are operated normally by the coupling power interface, which...
Intrabody communication using the human body as the transmission channel enables low-power wireless communication within a body area network. Using intelligent nodes it is expected that condensed information packets are transmitted between nodes reducing the data rate to a few kbit/s. This paper investigates the practical low-frequency transmission quality using capacitive signal coupling via custom-made...
The novel design with the adaptability prevents from unexpected stimulus current for medical safety, since the safety is the prime concern for human use. The prototype of the stimulus driver circuit for micro-stimulator used in implantable device is presented in this paper. For epilepsy control, the target of the driver is to output 30-μA stimulus currents, as the tissue impedance varies within 20~200...
Power efficiency is a very important issue for portable electronic devices since it determines the battery life. The backlight module usually accounts for the major part of power dissipation in a portable device. Thus, to extend the operation time of a portable device, a high efficiency backlight module should be employed. White light-emitting diodes (WLEDs) have replaced cold cathode fluorescent...
In this study, the process technology of contact-etching stop-layer (CESL) with LPCVD or PECVD is performed by interlayer-dielectric-SiNx stressing layer to form the tensile or compressive strained n/p MOSFETs. Because the strain effect on MOSFET devices is finite, the promoting performance of source/drain current is increased more while the channel lengths of the devices are decreased more. This...
In this paper, we propose a novel unipolar CMOS device with embedded oxide. Good inverter and logic gate output waveforms and behaviors are obtained. Utilizing the punch through effect, the Non-Classical Unipolar CMOS is demonstrated to enhance the tPLH so that the average delay time can be improved 23% when compared with the conventional CMOS. Due to all NMOS structures are only exploited and the...
A new STI-type FinFET structure with its body region been connected is demonstrated and characterized by using three-dimensional (3-D) numerical simulations. From the simulation results, the STI-type FinFET shows that the short-channel effects (SCEs) and the off-state leakage current are proved to be reduced because the threshold voltage (VTH) roll-off and the drain-induced barrier lowering (DIBL)...
In this work, we for the first time explore the dual material gate (DMG) and inverse DMG devices for suppressing random dopant fluctuation (RDF)-induced characteristics fluctuation in 16-nm MOSFET devices. The physical mechanism of DMG devices to suppress RDF are investigated and discussed. The improvement of DMG for suppressing the RDF-induced Vth, Ion, and Ioff fluctuation are 28%, 12.3%, and 59%,...
In this work, we explore the effects of the number of fins and fin structure on the device DC, dynamic behaviors, and random-dopant-induced characteristic fluctuations of multifin field effect transistor (FET) circuits. Multifin FETs with different fin aspect ratios [AR ≡ fin height (Hfin)/fin width (Wfin)] and a fixed channel volume are simulated in a three-dimensional device simulation and the simulation...
The re-encoding and coordinate transformation techniques are usually employed to reduce the computational complexity of interpolation, which is the most computation-intensive step in the algebraic soft-decision decoding of Reed-Solomon (RS) codes. In this paper, we present a high-throughput re-encoder design for soft-decision decoding a (255, 239) RS code. With the developed scheduling scheme and...
A hybrid method of computing reciprocal is presented by combining the degree-two piecewise polynomial interpolation method and a Newton-Raphson iteration. The degree-two piecewise method is used to obtain an initial approximation for the subsequent Newton-Raphson operations. Architecture for the proposed hybrid method is designed considering the hardware sharing of the composing multipliers in the...
A unified design is presented that can execute floating-point CORDIC operations in both rotation and vectoring modes with significantly reduced computation latency. Unlike previous pipelined CORDIC implementations usually requiring a sequence of micro-rotation stages proportional to bit accuracy, the proposed design consists of only two stages, coarse and fine stages, with each stage realized using...
The scale invariant feature transform (SIFT) is a very efficient algorithm to extract and describe distinctive invariant features from images, and usually applied for many image applications such as object recognition, robotic mapping, and navigation. In the SIFT computation, the complexity of the feature description is quite high. Hence, it is desirable to have an efficient VLSI architecture to compute...
In this paper, two non-ideal effects, carrier frequency offset (CFO) and IQ imbalance, are jointly compensated for an orthogonal frequency division multiplexing (OFDM) system. Based on the two identical sequences in the preamble, a LS-based method is proposed to estimate both CFO and IQ imbalance. This method has much lower complexity than the state-of-art expectation-maximization (EM) approach. Simulation...
A novel CNT/SiC/epoxy composite was proposed and demonstrated as adhesive joining element and heat dissipation media for HB-LEDs. Junction temperature, luminous intensity and forward voltage were measured for varied combinations in the composites. The experimental results showed that the epoxy with 30 wt% of SiC and 5 wt% of MWCNTs had the best thermal properties. Comparing to commercial epoxy, the...
For achieving higher performance of amorphous silicon thin film solar cell, the front-contact ZnO:Al is needed to be concerned. In this paper, we focus on how the front contact ZnO:Al influences the a-Si:H thin film solar cell. In order to understand the relationship between the front-contact ZnO:Al and device, we establish a model to simulate how the feature size of the textured ZnO:Al influence...
This study attempts to enhance the performance of dye-sensitized solar cells (DSSCs) by integrating the TiCl4 treatment on porous TiO2 and a novel high-reflective counter electrode, Pt/FTO/Al. Experimental results indicate that light scattered by TiCl4-treated large TiO2 particle sizes and light reflected by the counter electrode decrease the total transmission of the modified cell. Additionally,...
Hafnium-based dielectrics have been extensively investigated as a possible replacement for SiO2. Anhydrous Hf/Zr mixed-metal nitrate precursor HfxZr1-x(NO3)4 (HZN) was successfully synthesized and hafnium zirconate (HfxZr1-O2) thin films were prepared by the chemical vapor deposition (CVD) technique from this precursor. The basal dielectric properties of HfxZr1-O2 films were studied, and C-V curves...
Dual-core platforms are growing as a new industry trend as platforms with only one core cannot easily perform the diverse functions in current embedded system applications, such as smart phones. We establish an easy-to-use co-simulation dual-core virtual platform to validate the functionality of hardware and software jointly. In our platform, the hardware components are implemented by SystemC, and...
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