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Opportunities and challenges of copper wire bonding implementation in the automotive context are presented from two different viewpoints: manufacturability and reliability. Compared to gold, copper offers better thermal and electrical properties, but its higher hardness imposes a tighter process control and a dedicated approach to process setup, optimization and validation. Compatibility with the...
In this work we present results, both experimental and theoretical, related to corrosion of intermetallic layers that are formed at the interface between the bond pad and the bond ball. Aluminum smear adjacent to the bond ball leads to an initial crevice. Due to a galvanic corrosion process an oxygen deficit in the crevice might occur. Numerical simulations show that in the absence of oxygen the anodic...
Gold wire bonding has been widely used as the first-level interconnect in semiconductor packaging. The increase in the gold price has motivated the industry search for an alternative to the gold wire used in wire bonding and the transition to a copper wire bonding technology. Potential advantages of transition to a Cu–Al wire bond system include low cost of copper wire, lower thermal resistivity,...
Copper wire has become a mainstream bonding material in fine-pitch applications due to the rising cost of gold wire. In recent years, palladium-coated copper (Pd-Cu) wire is being increasingly used to overcome some constraints posed by pure Cu wire. During wire bonding with aluminum bond pads, different intermetallic compound (IMC) phases that have been identified at the bond interface are typically...
THz wave technique is available for nondestructive diagnosis on invisible metal surface covered with opaque coating and/or painting. The demonstrations are successfully conducted in which samples are insulated copper cable and hot-dip galvanized steel sheet.
Gold wire bonding has been widely used as first-level interconnect in semiconductor packaging. The increase in the gold price has motivated the industry search for alternative to the gold wire used in wire bonding and the transition to copper wire bonding technology. Potential advantages of transition to Cu-Al wire bond system includes low cost of copper wire, lower thermal resistivity, lower electrical...
Fine pitch copper wire bonding presents challenges to both first and second bond processes. Corrosion of the first bond copper-aluminum (Cu-Al) intermetallic compound bond interface layer can be induced by mobile chlorine in the epoxy mold compound, and the second bond process window can be narrower than with gold wire. Palladium-coated copper wire is believed to overcome these two problems, however,...
Understanding the moisture-induced corrosion mechanism of copper wire bonding is crucial for achieving longer life reliability of copper bonding. While the formation of Al-Cu intermetallic compound (IMC) is found to dominate the bond reliability, the mechanism remains unclear despite considerable efforts by experiments. Pourbaix (Eh-pH) diagrams have long been used to evaluate the theoretical activity...
Cu wirebonding become a great interest of industry in recent years due to its cost effectiveness and electrical and mechanical properties. However, several Cu wire bond reliability challenges are the key concerns in Cu wire deployment in semiconductor packaging. These include Cu wire oxidation and CuAl interface corrosion post HAST or UHAST reliability test. Bond reliability at a Cu wire bond under...
Copper (Cu) wirebond technology in IC packaging has become popular these days due to its better characteristic and cost compare to Gold (Au). Nonetheless, failure analysis remains to be very challenging as Cu is easily dissolved when it is reacted with fuming nitric acid used during standard decapsulation process. Hence, by utilizing enhanced manual decapsulation technique with mixture of fuming nitric...
The governing factors of copper wirebond failures under high humidity conditions were experimentally elucidated on the basis of the results of intermetallic compound (IMC) analysis using Scanning Transmission Electron Microscope (STEM). The IMC behavior at the bonding interface under high temperature storage (HTS) test and pressure cooker test (PCT) have been examined and compared. The results of...
The application of Palladium coated-Copper (Pd-Cu) wires is a solution to prevent copper oxidation during the copper wire bonding process. This is true for the Second Bond but may not be the situation when it comes to the First Bond, because during the Free Air Ball (FAB) formation, the Pd-Cu wire tip is melted and the Pd distribution on the FAB surface is dependent on several processing factors....
During the last few years, several developments have aroused great interest in the electrical industry. Two of the most important are: (1) the increasing price of copper; and (2) the development of new aluminum alloys for wire. A quick comparison of costs of aluminum and copper ingot or redraw rod since 1940 (Figure 1) clearly shows the economic reasons for replacing copper with aluminum in conductor...
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