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For a limited solder volume interconnect structure, bump interconnect reliability is more sensitive to the growth behavior of the interfacial intermetallic compounds(IMCs). The study of the effect of solder cap thickness on the interfacial diffusion reaction is of great importance to the application of copper pillar bump. Here, we investigated the effect of different solder cap thicknesses on IMCs...
In this paper, the effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution has been investigated. Additive W weight content of Ni-W alloy ranged from 16 to 18 at. %. Controlled thickness of barrier layer was prepared on Cu substrate. Then, excessive matte Sn electroplated on as-deposited Ni-W layer. Ni-W had compact microstructure in state of FCC solid solution, which means it had good...
This paper investigated the individual effects of thermomigration behavior in Cu/Sn58Bi/Cu solder joints by applying a pure thermal gradient field at an ambient temperature of 20°C. To separate electromigration behavior, a novel apparatus was used to carry out the thermomigration experiment. The thermal finite-element simulation results showed that a sufficient thermal gradient existed in the Cu/Sn58Bi/Cu...
The experimental samples mainly are the assembled OSP PCB with the Plated-Through-Hole (PTH) components which leads are manufactured with Sn/Ni/Cu substrates and the soldering process is Wave-Soldering (W/S) with two kinds of lead-free SAC solder bars categorized as Sn-3.0wt%Ag-0.5wt%Cu (SAC305) and Sn-0.3wt%Ag-0.7wt%Cu (SC0307). In addition, the test conditions are defined that the experimental temperatures...
Effect of Cu substrates and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging was investigated. Solder joints with three types of Cu bonding pads (electroplated Cu, polycrystalline Cu and single-crystal Cu) and Sn-based solders (Sn-3Ag-0.5Cu and Sn-37Pb) were prepared, and subsequently the samples were aged at 150°C and 175°C, Under the same aging conditions,...
In flip chip technology, the Ni(V)/Cu multi-metallic thin-films is a widely used under bump metallization (UBM), for doping 7 wt.% V into the Ni target can eliminate the magnetism of Ni during sputtering. It was noted that V in the Ni(V) layer did not react with solders and intermetallic compounds (IMC) during reflow and aging process, yet a Sn-rich phase, as the so-called "Sn-patch", would...
It is gradually recognized that Sn-Ag-Cu is better alloy system for application prospect in the lead-free solders. In order to cut down the cost and improve properties, researchers have always been searching for proper compositions and adding elements to improve properties actively. This paper has investigated the effect of Ni addition on Sn-0.3Ag-0.7Cu (SAC0307) low-Ag solder joint. The results of...
Due to the miniaturization trend and functional demand in high-density microelectronic packaging, the thermomigration in flip chip solder joints owing to the joule heating becomes a serious reliability issue. In this study, a novel apparatus which can provide a sufficient temperature gradient cross the solder joint in the specimen was used to carry on the thermomigration experiment separated from...
The changes of morphology and growth tropism of inter-metallic compound (IMC) and IMC growth rate at lead-free solders/Cu interface of solder joints often limit the reliability of the entire package during service. Furthermore, during thermal-shearing cycling process, the thickness of IMC at the interface grows significantly and growth tropism of IMC changes, resulting in in-service evolution of the...
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