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Tin-plated copper structure was widely applied in the electronic products. With the development of the electronics industry, the integration degree increased and the component size reduced obviously. The conventional tin plating technology met the micro-structure challenge; it may not be used in advanced electronic packaging process. The electroless tin plating technology could solve this problem...
In electric power transmission, copper and aluminum are mainly used as conductor materials. To improve the contact behavior, the contact surfaces of e.g. high-voltage switching devices are often coated with silver or nickel. Due to economic reasons, connecting conductors are usually uncoated. In that case, an electrical joint with only one coated contact partner is formed. With respect to the permissible...
In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM)...
The effect of thermal aging temperature and external tension on the formation and growth of tin whisker from Sn electroplating coating was studied by use of scanning electron microscopy(SEM)in this article. It is shown that the unbiased temperature accelerates the formation and growth of tin whisker. However external tension do not obviously promote the formation and growth of tin whisker. After coating...
The effect of thermal aging temperature and external tension on the formation and growth of tin whisker from Sn electroplating coating was studied by use of scanning electron microscopy(SEM)in this article. It is shown that the unbiased temperature accelerates the formation and growth of tin whisker. However external tension do not obviously promote the formation and growth of tin whisker. After coating...
In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM)...
We have studied aging in laser ablated 2 wt% BaZrO3 doped GdBaCuO (GdBCO) thin films. The films were coated with gold, silver, copper, photoresist and stycast. One film was left without coating for reference. The superconducting and structural properties were followed for several months. The critical temperature Tc and current density Jc were determined from magnetization measurements. The changes...
Gradually diminishing solderability and potential risk of whisker growth are two major concerns in using immersion tin as a final finish for printed wiring boards. Both phenomena are attributable to the spontaneous formation of intermetallic compounds (IMC) of Cu6Sn5 and Cu3Sn between the tin coating and copper substrate. The formation of IMC consumes the free tin in the coating that is essential...
1) In spite of the complicated ageing behaviour of wire coatings the EAP method produces results of satisfactory reliability. 2) Effect of the base metal on the thermal endurance of the coating varies very much, depending on the coating type. Whereas the effect on poly(vinyl acetal) seems to be negligible, it is very significant on AI overcoated polyester, giving to Aluminium wires 15 … 20 K higher...
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