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Tin-plated copper structure was widely applied in the electronic products. With the development of the electronics industry, the integration degree increased and the component size reduced obviously. The conventional tin plating technology met the micro-structure challenge; it may not be used in advanced electronic packaging process. The electroless tin plating technology could solve this problem...
Since miniaturization of electronic devices makes the joint height of solder joints shrink to tens of microns. IMCs take noticeably high volume ratio in solder joints, which seldom happens in BGA or bulk solder joints. Growth of IMCs volume ratio will definitely affect mechanical integrities of micro-scale solder joints, which is rarely covered in pervious publications. In this paper, copper/SAC305/copper...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
A new lead-free solder alloy Sn3Ag0.5Cu3Bi0.05Cr (SACBC) was prepared by adding 3.0 wt.% Bi and 0.05 wt.% Cr on the basis of the composition of Sn3Ag0.5Cu(SAC). The tensile strength and the growth behavior of the interfacial intermetallic compound (IMC) of SAC/Cu substrate and the SACBC/Cu solder joints during isothermal aging at 150°C for 0, 24, 168, 500 and 1000 hours were comparatively investigated,...
Selective catalytic reduction (SCR) of nitrogen oxide (NO) technology has widely applied in a combustion process to decline the concentration of NO due to its impact on the environments concerns. In this study, mesoporous SBA-15 was used as support material to load Cu catalyst to undergo the DeNOx reaction by CO. Cu/SBA-15 catalyst were prepared by polyol method and investigated by XRD, TEM and FTIR...
In microelectronic packaging, the reliability of Pb-free solder joint is critically influenced by the interfacial reactions with under bump metallurgies (UBMs), and therefore controlling the intermetallic compound (IMC) formation and growth is recognized as a very important factor for improving the reliability of the solder joints. A silver (Ag) alloying element is broadly used in Pb-free solder alloys...
Sporadic voiding within the interfacial Cu3Sn intermetallic compound (IMC) layer-sometimes referred to as ??Kirkendall voiding??-has been found to lead to degradation of solder joint reliability in board level, mechanical shock testing. It has been suggested that the voiding phenomenon is a result of the incorporation of organic impurities in the copper (Cu) deposit during electroplating. In the present...
This paper details the outgassing process during epoxy degradation and evaluates the corresponding influence on adjacent PWB pads for immersion Ag (ImAg) plated circuit boards. Three commercial epoxy adhesives used for edge-bonding of surface-mount (SMT) components were investigated. Scanning electron microscope (SEM) analysis and electron dispersive spectroscopy (EDS) was carried out to investigate...
This study utilized out high speed lap-shear tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150??C and 170??C) were also tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the lap-shear...
This study investigated the thermal effect on the interfacial IMC (Cu3Sn and Cu6Sn5) formation at the interface between pure tin and a copper substrate at 125degC. During thermal aging, the morphology of Cu6Sn5 transformed from a scallop to a layer shape. The thickness of IMCs (Cu3Sn, Cu6Sn5) changed with an increase in aging time. It was observed that scallop Cu6Sn5 decomposed during heat aging for...
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