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The mechanical behavior of lead free solders is highly dependent on the testing temperature. Previous investigations on mechanical characterization of conventional and doped lead free SAC solders have mainly emphasized stress-strain and creep testing at temperatures from 25 to 125 °C. However, solders are exposed to very high temperatures from 125–200 °C in several harsh environment applications including...
Due to aging phenomena, the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal and/or thermal cycling environments. In our ongoing studies, we are exploring aging phenomena by nano-mechanical testing of SAC lead free solder joints extracted from PBGA assemblies. Using nanoindentation techniques,...
SAC-Ti alloys exhibited significantly improved drop test performance over not only SAC alloys, but also 63Sn37Pb for ENIG/OSP, NiAu/OSP, and OSP/OSP surface finish systems. The superior performance is attributed to (1) the increased grain size and dendrite size, therefore reduced hardness of solder, (2) inclusion of Ti in the IMC layer, and (3) reduced IMC layer thickness. DSC data indicate that the...
The aim of this research is to investigate the mechanical behavior of lead-free solder for high speed impact. A high speed impact test was set up to measure the solder joint reliability. Differential impact speed and room temperature aging effect has been studied with Ni/Au substrate. Furthermore, two different solder alloys (96.5Sn-3Ag-0.5Cu, 98.5Sn-1Ag-0.5C) and three different reflow profiles are...
Corrosion in Co-Ni-O film, which is adopted as the magnetic layer in metal evaporated tape media, was examined through aging tests, measurements of anode polarized characteristics, and analysis of both chemical bonding by ESCA and of crystallographic characteristics by RHEED. The following results were obtained. 1) The experimental results for exposure tests were strongly correlated with the anode...
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