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This study presents a three by three flexible tactile sensor array using stretchable silicon spring with doping silicon. Each tactile sensor device is located at the silicon-unit of a distributed 2D chip-network, which are mechanically and electrically connected to surrounding devices by stretchable silicon spring. The doping silicon acts as a piezo-resistive sensing element embedded into the membrane...
The aim of this project is to develop a novel device, using a micro force sensing array, which can be used to study forces involved in cell migration and the cellular responses to drugs that may inhibit migration or induce differentiation. The system was modelled with an optimum geometry of 1 pm diameter and 10 pm length for forces down to 1 nanometre. Devices were fabricated using conventional photolithography...
A passive haptic interface that is inherently safe and stable and can present variable virtual asperity was developed. This interface delivers passive resistance force by switching on and off the damping brake of a DC motor without being driven. We conducted identification experiments for six levels of asperity stimuli to investigate human perceptual properties against passive asperity. Variable asperity...
Electrostatic adhesion force is studied and analysed with emphasis on design parameters of the interdigital electrodes, material properties of dielectric layers and its thickness. From these results two fabrication processes of the electroadhesive foils are studied to reach the highest possible performance. Experimental measurements are carried out to verify the results.
This paper purposes a portable multispectra tunable forensic lens for jadeite analysis. The visible and ultraviolet light are used to detect the absorption spectra of natural jadeite, implement jadeite, and jadeite color spectra around 550∼700 nm. Besides, tunable lens with three-step (5, 7 and 10 X) magnification is based on the dielectric liquid lens.
Zynq System-on-Chip (SoC) integrates both Processor and Programmable Logic architectures, where the whole functionality of a system is placed on a single chip. Due to the advancement of process technology, the complexity of circuit analysis becomes harder and the failure modes are becoming marginal, e.g., leakage in nano-ampere range. SoC devices require very challenging work for failure localization...
The preponderance of research into flying microrobots has focused on biomimetic flight mechanisms. In this work, we demonstrate an insect-scale robot capable of vertical takeoff using electrohydrodynamic thrust, a mechanism with no natural analogue. The 10mg, 1.8cm by 1.8cm “ionocraft” operates at about 2400 volts and has a thrust to weight ratio of approximately 10. Feasibility of using individually...
Single crystal silicon is a popular material used for semiconductor circuits and solar batteries. In the cutting process from a silicon ingot to a silicon wafer used as semiconductor materials, a multi-wire saw with fixed diamond abrasive grains is widely used due to recent increases in wafer size and reductions in wafer thickness. Also, single crystal silicon can achieve ductile mode cutting when...
This paper presents two mechanisms to enable jumping microrobots. These small jumpers must store considerable mechanical energy and quickly release it. The first mechanism presented is a mechanical gain stage capable of amplifying the force generated by a standard inchworm motor by at least 10 times. This mechanism could be used with any style of inchworm motor. Secondly, a latching mechanism was...
(We describe the fabrication, characterization and operation of a microfabricated, overhanging micromachined SU-8 device that can stretch and compress individual cells. This compliant device is composed of folded beams with a single actuation point. Upon actuation with a glass micropipette attached to an XYZ positioner, it can apply varying deformation to multiple cells simultaneously. The applied...
We present work on characterizing the speed of electrostatic actuators for applications in microelectromechanical systems (MEMS) based microrobotics. The actuators are based on electrostatic gap closers working in an inchworm motor configuration and fabricated in silicon. Measurements are taken using sidewall contacts on the gap stops of our devices. We have shown that our electrostatic gap closers...
This paper presents an investigation on combined surface modifications and their effects to tribological properties of Si (100) flat surfaces. At first, micro-patterns were fabricated on Si wafers using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterns include of pillars and channels shape in micro-scales. Secondly, the Si micro-patterns were coated by thin...
Ultra-thin wafer (thickness <100 µm) gripper is a challenging component to design since the wafer is one of the thinnest and fragile materials. In this paper, a soft acting non-contact gripper based on the distributed Bernoulli principle for ultra-thin wafer is developed and evaluated. The theoretical analysis and experimental studies of the designed gripper are carried out. The effects of the...
The objective of the project is to develop a model for the capacitive ultrasonic transducer described in the Ladabaum et al., [1] paper. The main element of the transducer is a metalized silicon nitride membrane suspended on a rigid support above a heavily doped silicon bulk. The cavity under the membrane is vacuumed. When a voltage is applied between the metalized membrane and the bulk, the Coulomb...
Exponential signal categories, usual in the orthodontic dynamics, are considered, damped aperiodic in relation to time and space. They are expressed through time and space constants. For predetermined conditions, expressed in final durations, final lengths and inflexion points, respectively, this paper presents a digital method for determining the structure parameters, by the resolution of two categories...
In haptic perception information is often sampled serially over a certain interval of time. For example, a stimulus is repeatedly indented to repeatedly estimate its softness. Albeit such redundant estimates are equally reliable, they seem to contribute differently to the overall haptic percept in a comparison task. When comparing the softness of two silicon rubber stimuli, the within-stimulus weights...
Fan-out wafer level packaging technology becomes more attractive and popular in the semiconductor packaging industry. The fan-out wafer level package (FOWLP) has the feature of integrating various devices in a tiny form factor. Since the FOWLP size is compact and small, its package strength is critical to its reliability. In this work, the three-point bending test method and finite element method...
Among the technological developments pushed by the adoption of Through Silicon Vias and 3D Stacked IC technologies, wafer thinning on a temporary carrier has become a critical element in device processing over the past years. First generation of adhesive materials enabled the integration of the first devices at the expense of capping the thermal budget. Hence new generation materials are being explored...
As IC technologies continue scaling down, traditional electrostatic discharge (ESD) devices can no longer meet the demands of modern protection, prompting the need for novel device structures. A novel and unique approach to ESD protection using suspended graphene ribbon devices is presented. It has been demonstrated the ribbon's electro-mechanical response to a sudden surge of charge, such as an ESD...
This paper presents a universal self-aligned in situ on-chip micro tensile fracture strength tester designed for tensile strength extraction and process evaluation, which will provide, for the first time as far as the authors know, great force(above 100mN) to in situ on-chip specimen without the introduction of precise instrument, especially suitable for bulk micromachining related tests. The whole...
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