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For the miniaturization and multifunction of electronic devices, the vertical interconnection technology has been developed to replace the traditional planar packaging technology. The interposer connection using double-side solder bump is used as the vertical interconnection technology in this study. Three kinds of solder bumps with different diameters of 0.76mm, 1.2 mm and 2mm were prepared and mounted...
Owing to the limitation of the fine pitch and the fine area array assembly, fine pitch package or micro BGA are facing challenges such as miniaturization, high density and assembly problems along with the rapid development of the high-density electronic packaging and surface mount assembly. The major limitation of the fine pitch packages is around 0.3mm. Exceeding this limitation encounters reliability...
Sn-Ag-Cu (SAC) solder is one of the most promising candidates to replace Sn-Pb (SnPb) solder alloys. Reducing the amount of Ag phase is an important approach to obtain new SAC solders with lower cost. In this article, different proportions of Bi element were added into Sn-1.0Ag-0.5Cu (SAC105) lead-free solders. The melting points of these alloys are examined and the corresponding tensile properties...
The plasma activation is a promised process to improve the bonding performance for materials pretreated with the plasma. In this study, the chips studded with gold bumps flipped-bonding onto alumina substrates using the thermal compressional bonding. To improve the bonding performance of gold bumps onto copper electrodes, both gold bumps and alumina substrates were pretreated to Ar/H2 plasma at 400...
In this study, a steady and comparatively smooth Ni-P coating on the surface of diamond/Al composite substrate was fabricated by electroless plating, which can outstandingly improve solderability of the composite. By controlling the deposition time, we obtained the growth curve of the Ni-P coating, and as a result we can adjust the thickness of the coating. The solderability was tested by soldering...
Defect of SAC305 large-size BGA components attached with SnPb solder was analyzed by metallographic examination, and the faulty welded joint was found at the center position of the component. In order to explain the failure mode, reflow process simulation on assembled PCB board was carried out by ANSYS, and the temperature distribution was deeply studied. It is shown that there a obvious difference...
In this study three-dimensional finite analysis models of 3D micro-scale chip scale package (CSP) solder joints were set up. The stress-strain distribution of micro-scale CSP solder joints was obtained by finite element analysis under the condition of random vibration load. The influence of different solder, pad diameter and solder joint volume on the stress-strain of micro-scale CSP solder joint...
The lead-free solders are adopted to avoid lead pollution in the past decades, however, the mechanical behaviors under complex loading are still requires further study. For example, change of environment temperature is one of the hazards affecting the electronics reliability, especially the temperature cycles which will increase the temperature damage rapidly and the working life could be reduced...
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb, designated as Indalloy276, was developed targeting for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature range of 223 to 232°C, reflowable at profile with peak temperature 245°C and 255C, with ambient temperature Yield stress 60MPa, UTS 77 MPa, and ductility 28%, and a higher stress than both...
The samples were soldered using copper pillars and Sn-3.0Ag-0.5Cu solder paste with a typical reflow profile about peak time of 245°C. In order to observe the microstructure and crystal orientations, the sample is grinded and polished to be characterized by scanning electron microscope (SEM) and electron backscattered diffraction (EBSD). By analyzing the microstructure and crystal orientation, the...
The mechanical properties and microscopic mechanism of the solder joint at cryogenic temperature were studied. The effects of temperature and Pb content on the reliability of the solder joint were investigated. The temperature has a significant influence on the shear strength of the solder joint. As the temperature decreases, the shear strength increases continuously, and the shear strength of solder...
Recently, developing thick interfacial intermetallic compound layers with rough morphology has been detrimental to the long term solder joint reliability for lead free solders currently. A novel method has been developed to control the morphology and growth of intermetallic compound layers between pure Sn solder ball and Cu substrate by doping flux with amount of 2wt.% metallic Cu nanoparticles. And...
Due to the promotion of the globalization of environmental protection process, some high reliability requirements of electronic products have to be passive to the backward compatible soldering process. Compared to the traditional Sn-Pb soldering process and the current mature Pb-free soldering process, the backward compatible soldering process is faced with a smaller process window and a higher process...
To study the thermal cycling reliability through the SMT technology, this paper based on the EAM experiment to test the correction of the ANSYS analysis. We have a deeper comprehend on the affluence of the creep property, to give a conclusion whether the SMT technology is reasonable. The results show: QFN solder is the main factor; In the thermal recycle analysis, the location in the edge of solder...
The effect of anisotropy in β-Sn grain on electromigration (EM)-induced failure mechanism of the Ni/Sn-3.0Ag-0.5Cu/Ni-P solder interconnects was in situ investigated. Sn grain orientation was a crucial factor in dominating the EM behavior. When the c-axis of Sn grain was parallel to the electron flow direction, a larger EM flux was induced, resulting in an excessive dissolution of Ni at the cathode...
We report the effects of multiple reflow cycles on the reliability of Sn-Sb solders. Reflow soldering technology was used to prepare the Sn-Sb joints after 1 reflow cycle, 2 reflow cycles and 3 reflow cycles. We found that the intermetallic compound layers became thicker and denser with the reflow cycle increased. And the samples here had good bonding quality with only a few voids. After 600 thermal...
The structure design of ceramic package for packaging system in package is introduced in this paper. The reliability experiments of multi-layer ceramic package were simulated and analyzed by using the finite element method. We mainly studied the influence of the side size and sealing ring size on the reliability of the ceramic package structure, analyzed the stress and strain distribution of the ceramic...
In the transition to lead-free process, one of the most prominent problems is the lead-free solder joint interconnection reliability. Interconnection failure analysis is an important tool for improving the lead-free PCBA product design as well as assembly process quality. Combining a typical fault case, this study deeply analyzed the failure phenomena and the failure mechanism as to interconnection...
Glass tube sealed diode was widely used in electronics industry because of its excellent performance in air tightness, electrical insulation and so on. However, the poor performance of glass during high and low temperature circle lead to a high ratio of failure during specific experiment. By the operate process experiment and detection experiment, the influence of process factors on devices reliability...
Most existent studies of nanosilver paste, a promising package material, focused on a relatively small sintering area (< 100 m2). In this study, we were trying to bond 40 mm × 40 mm copper baseplate with 25 mm × 25 mm DBC using nanosilver paste in low temperature and pressure. Shear strength distribution and morphology was reported in this work. Through this process, the average shear strength...
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