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Copper wire has been popular in these years when facing ever-increasing gold prices. The success of large scale conversion of gold to copper wire in microelectronics could achieve successfully when all the failure mechanisms that can be discerned during reliability testing. One of these mechanisms is corrosion of the contact between the copper (Cu) ball and the aluminum (Al) bond pad, consisting of...
Cu wires are increasingly used instead of gold wire and gradually become a mainstream in micro-electronic package interconnection, especially in fine pitch and low k wafer technology. The advantages of Cu wire over gold wire are well known for its high thermal conductivity, great electrical property and low cost. For Cu wires on Automobile devices application, especially with wafer technology keep...
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