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Copper wire has been popular in these years when facing ever-increasing gold prices. The success of large scale conversion of gold to copper wire in microelectronics could achieve successfully when all the failure mechanisms that can be discerned during reliability testing. One of these mechanisms is corrosion of the contact between the copper (Cu) ball and the aluminum (Al) bond pad, consisting of...
In today's trend in semiconductor wirebonding assembly process, Copper (Cu) wire was presented as viable solution and alternative cost saving options to gold (Au) wire. The use of Cu wire found to be even better than Au, because of its high thermal conductivity, great electrical property and importantly low cost value. However, Cu have some challenges that needs to carefully understand, it natural...
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