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Background Coexistence of aspergilloma and allergic bronchopulmonary aspergillosis (ABPA) has rarely been reported. Although the treatment for ABPA includes administration of corticosteroids and antifungal agents, little is known about the treatment for coexisting aspergilloma and ABPA. Furthermore, the impact of surgical resection for aspergilloma on ABPA is not fully understood. Here, we present...
Glass and fused silica are promising material used as a substrate for RF components because of good electrical properties such as low permittivity and low dielectric loss tangent. What's more, glass and fused silica have higher bulk resistance because of insulation material, and superior stabilities against environmental changes as packaging level. This study explores, firstly a methodology and measurement...
Through via formation is definitely the key for coming the advanced packaging which includes heterogeneous integration and high speed wireless communication. Glass and fused silica are well known as a great candidate for a core material for high frequency application as a result of high bulk resistance and lower dielectric loss. One of the important subjects in order to use through glass vias (TGV)...
We observed the Drude response of photoexcited electrons in high resistivity silicon by using single-shot terahertz spectroscopy. In contrast to conventional optical-pump and terahertz-probe spectroscopy, this technique can significantly reduce the measurement time and repetition rate of pump pulses. As a result, the dynamics of long-lived photoexcited carriers in silicon is clearly observed without...
This study explored Through Glass Via (TGV) Formation Technology by using Focused Electrical Discharging Method for alkali-fee glass which has well matched CTE with Si. 2.5D/3D Packaging has presently attracted lots of attention, an interposer is recognized as one of key materials, and its development of new fine pitch, high dense, and low cost interposer are accelerated. Glass is expected as one...
This study explores Through Glass Via (TGV) Formation Technology for alkali-fee glass which has well matched CTE with Si. 3D Packaging has presently attracted lots of attention. The interposer is recognized as one of key materials, and its development of new fine pitch, high dense, and low cost interposer are accelerated. Glass is expected as one of candidates as material of future interposer substrate...
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