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Glass and fused silica are promising material used as a substrate for RF components because of good electrical properties such as low permittivity and low dielectric loss tangent. What's more, glass and fused silica have higher bulk resistance because of insulation material, and superior stabilities against environmental changes as packaging level. This study explores, firstly a methodology and measurement...
Through via formation is definitely the key for coming the advanced packaging which includes heterogeneous integration and high speed wireless communication. Glass and fused silica are well known as a great candidate for a core material for high frequency application as a result of high bulk resistance and lower dielectric loss. One of the important subjects in order to use through glass vias (TGV)...
Bismuthate erbium (Er)-doped waveguide amplifiers consist of an Er-doped core surrounded by an Er-free cladding film with lower refractive index. The propagation loss of a waveguide critically depends on both the thickness and the refractive index of its core and cladding films; hence, these two properties of such films must be controlled. We studied the influence of magnetic fields on a batch-to-batch...
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8...
This study explored Through Glass Via (TGV) Formation Technology by using Focused Electrical Discharging Method for alkali-fee glass which has well matched CTE with Si. 2.5D/3D Packaging has presently attracted lots of attention, an interposer is recognized as one of key materials, and its development of new fine pitch, high dense, and low cost interposer are accelerated. Glass is expected as one...
This study explores Through Glass Via (TGV) Formation Technology for alkali-fee glass which has well matched CTE with Si. 3D Packaging has presently attracted lots of attention. The interposer is recognized as one of key materials, and its development of new fine pitch, high dense, and low cost interposer are accelerated. Glass is expected as one of candidates as material of future interposer substrate...
This study explored glass microfabrication technologies for TGV (Through Glass Via) formation can be applied interposer substrate of 3D packaging. Two TGV formation methods were studied and compared such as optical approach using Excimer laser and electrical approach using focused electrical discharging. Demonstration of laser microfabrication showed the result of 40um pitch of TGVs which is able...
This paper demonstrates thin glass interposers with fine pitch through package vias (TPV) as a low cost and high I/O substrate for 3D integration. Interposers for packaging of ULK and 3D-ICs need to support large numbers of die to die interconnections with I/O pitch below 50 μm. Current organic substrates are limited by CTE mismatch, wiring density, and poor dimensional stability. Wafer based silicon...
Gain characteristics of 8-channels Er-doped bismuthate waveguide array are measured under bidirectional pumping at 1480 nm. Over 19-dB gain with flatness of 2 dB at whole C-band has been obtained using a 25-cm long waveguide.
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