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The high temperature storage test (HTST) was conducted on the SnAgCu/Ni-W-P and Ni-Fe solder joints. While the conventional Ni-P solder joints were used as comparison to study the diffusion barrier effect of Ni-W-P and Ni-Fe under bump metallization (UBM). Both cross section and top view for the microstructural evolution of solder joints during 150°C aging were observed by the scanning electron microscope...
The high temperature storage test (HTST) was conducted on the SnAgCu/Fe-Ni solder joints. The microstructural evolution during aging at 125°C was observed by both Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM). During the reflow process, FeSn2 layer and rod-like (Cu,Ni)6Sn5 grains were formed. During the aging at 125°C, dispersed (Cu,Ni)6Sn5 with two distinct morphologies...
In this study, phase transformations at the interfaces between two nearly mutually insoluble elementary substances, In-48Sn solder and Cu, were investigated during serial solid-state aging process. The reversible phase transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds were observed, which are extremely rare to occur in one and the same system. The corresponding interfacial reactions were...
In this study, phase transformations at the interfaces between two nearly mutually insoluble elementary substances, In-48Sn solder and Cu, were investigated during serial solid-state aging process. The reversible phase transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds were observed, which are extremely rare to occur in one and the same system. The corresponding interfacial reactions were...
Chip scale packaging (CSP) samples with Fe-Ni UBM barrier layer were successfully fabricated by actual process. Solid interfacial reactions between SAC105 and three kinds of Fe-Ni UBM barrier layers of different composition had been investigated to clarify the phase evolution of Fe-Ni/SAC solder joints. Microstructural investigation revealed that after reflow only a thin FeSn2 layer was formed on...
The interfacial microstructure and Kirkendall voids between eutectic SnIn and polycrystalline Cu substrate was investigated after reflowing and long-term solid-state aging process. The results indicated that two crystal-structure IMC species: Cu(In, Sn)2 phase existing at the solder side and Cu2(In, Sn) phase locating at the Cu side, among which Cu2(In, Sn) phase with two different morphologies, the...
The evolution of microstructure on aging of an (α+β) titanium alloy (Ti-5Al-5Mo-5V-1Cr-1Fe) in the β and (α+β) solution-treated and quenched conditions was investigated. The presence of very fine ω phase was detected by electron diffraction for samples aged below 400 °C. The fine α aggregates are uniformly formed within β grains by nucleating at the ω particles or β/ω interfaces. At higher temperature,...
Transmission electron microscopy (TEM) observations were carried out to investigate the microstructural evolution of SnBi/single crystal (100) Cu interface during reflow and solid-state aging process. It was found that there were two kinds of IMCs, Cu6Sn5 and Cu3Sn, at the interface after reflow. The Cu3Sn grains grew along [100] direction of Cu with columnar morphology. During aging, new triangle...
The microstructures of SnBi/Cu interconnect after reflow and its evolution during solid-state aging at 393 K were investigated using transmission electron microscopy (TEM). It was found that after reflow there were two kinds of intermetallic compounds (IMCs) - Cu6Sn5 and Cu3Sn in solder joint. Above these IMC layers there was a Bi-rich layer which consisted of discontinuous Bi particles. During solid...
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