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The high temperature storage test (HTST) was conducted on the SnAgCu/Ni-W-P and Ni-Fe solder joints. While the conventional Ni-P solder joints were used as comparison to study the diffusion barrier effect of Ni-W-P and Ni-Fe under bump metallization (UBM). Both cross section and top view for the microstructural evolution of solder joints during 150°C aging were observed by the scanning electron microscope...
The high temperature storage test (HTST) was conducted on the SnAgCu/Fe-Ni solder joints. The microstructural evolution during aging at 125°C was observed by both Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM). During the reflow process, FeSn2 layer and rod-like (Cu,Ni)6Sn5 grains were formed. During the aging at 125°C, dispersed (Cu,Ni)6Sn5 with two distinct morphologies...
Fe-Ni film with compositions of 45wt.% Ni, which is also denoted as Fe-45Ni, was used as under bump metallization (UBM) to evaluate the interfacial reliability of SnAgCu/Fe-Ni solder joint under electromigration (EM) test. For comparison, commercial Cu UBM was also adopted in the reliability test. The microstructural evolutions of these two UBM solder joints were observed by scanning electron microscope...
The failure of solder joints on Cu-Fe-P lead frame of power MOSFETs was found after long term services. The microstructures of failed and accelerated experimental solder joints have been investigated in detail in order to find out the failure mechanism. SEM, TEM, EDS and EPMA techniques were used in this study. Observed results showed that all failed MOSFETs had worked in the higher current while...
The failure of solder joints on Cu-Fe-P lead frame of power MOSFETs was found after long term services. The microstructures of failed and accelerated experimental solder joints have been investigated in detail in order to find out the failure mechanism. SEM, TEM, EDS and EPMA techniques were used in this study. Observed results showed that all failed MOSFETs had worked in the higher current while...
Chip scale packaging (CSP) samples with Fe-Ni UBM barrier layer were successfully fabricated by actual process. Solid interfacial reactions between SAC105 and three kinds of Fe-Ni UBM barrier layers of different composition had been investigated to clarify the phase evolution of Fe-Ni/SAC solder joints. Microstructural investigation revealed that after reflow only a thin FeSn2 layer was formed on...
The interfacial microstructure and Kirkendall voids between eutectic SnIn and polycrystalline Cu substrate was investigated after reflowing and long-term solid-state aging process. The results indicated that two crystal-structure IMC species: Cu(In, Sn)2 phase existing at the solder side and Cu2(In, Sn) phase locating at the Cu side, among which Cu2(In, Sn) phase with two different morphologies, the...
The microstructures of SnBi/Cu interconnect after reflow and its evolution during solid-state aging at 393 K were investigated using transmission electron microscopy (TEM). It was found that after reflow there were two kinds of intermetallic compounds (IMCs) - Cu6Sn5 and Cu3Sn in solder joint. Above these IMC layers there was a Bi-rich layer which consisted of discontinuous Bi particles. During solid...
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