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Isothermal aging causes degradation in the mechanical behavior of lead-free solder materials used in microelectronic packaging, leading to significant reductions in product reliability. In this work, we have characterized the aging-induced changes that occur in the mechanical properties and creep behavior of actual solder joints. These changes occur due to microstructure evolution and residual strains/stresses...
In this work, we have used nanoindentation methods to explore the creep behavior, and aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to 125 oC. A special high temperature stage and test protocol was used within the nanoindentation system to carefully control the testing temperature, and make the measurements insensitive to thermal drift problems. Solder joints...
In this work, we have examined the ability of microalloy additions (dopants) to reduce aging effects in solder joints by nanoindentation testing of several sets of doped/non-doped alloys. The investigated solder joint alloys included SAC105, SAC105+Ni, and SAC105+Mn. For the doped alloys, the base SAC105 solder in the PBGA component solder balls was modified by microalloying an additional small amount...
In this work, aging phenomena in solder joints have been explored by nano-mechanical testing. Using nanoindentation techniques, the elastic, plastic, and creep behavior of SAC305 solder joint materials have been explored for various aging conditions. Single crystal solder joints were first extracted from PBGA assemblies (14 × 14 mm, 0.8 mm ball pitch, 0.46 mm ball diameter), and then subjected to...
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