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In this work, we have used nanoindentation methods to explore the creep behavior, and aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to 125 oC. A special high temperature stage and test protocol was used within the nanoindentation system to carefully control the testing temperature, and make the measurements insensitive to thermal drift problems. Solder joints...
In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy (SPM) have been utilized to examine aging induced microstructural changes occurring within lead free solders. Unlike many prior studies, fixed regions in the solder joint cross-sections were monitored throughout the aging process, rather than examining different samples and/or different regions after the various...
Due to growing environmental concerns, lead-free solder materials are being widely used in electronic assemblies. The Anand viscoplastic constitutive model is frequently used to represent mechanical behavior of lead-free solder materials in finite element simulations. However, prior experimental results have demonstrated that properties of lead-free solder materials degrade over time when exposed...
Isothermal aging of lead-free Sn-Ag-Cu (SAC) solder joints leads to growth of intermetallic (IMC) particles in the solder bulk as well as growth of intermetallic layers at the joint interfaces with copper bond pads. Fracturing near the interfacial IMC layers is often found to be the primary reason for failures caused by drop impacts. The IMCs in SAC joints are primarily AgsSn and Cu6Sn5 binary compounds...
Reliable lead free solders are needed for products exposed to extreme environments such as those used in the automotive, avionics, and oil-exploration industries, as well as in military applications. In this study, stress-strain curves have been measured for several doped Sn-Ag-Cu (SAC) solder materials at high temperatures up to 200 °C, and their performances have been compared to those for standard...
Lead free solder materials are susceptible to significant creep deformations in harsh high temperature environments including automotive, avionics, military, and oil exploration applications. In addition, dramatic degradations will occur in the creep responses of lead free solder alloys when they are exposed to long term isothermal aging during product applications at high temperatures. Such degradations...
Lead free solder materials are widely used in the electronic packaging industry due to environmental concerns. However, experimental testing and microstructural characterization have revealed that Sn-Ag-Cu (SAC) lead free solders exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. In our prior studies on aging effects, we...
The mechanical behavior of lead free solder materials is often represented using the Anand viscoplastic constitutive model. This nine parameter model is built into popular commercial finite element codes, and is widely used in the electronic packaging industry. Reliability prediction results are often highly sensitive to the specified Anand parameters, and there are great variations in the available...
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