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The influence of binary acceptors of indene-C60 bisadduct (ICBA) and 3,9-bis(2-methylene-(3-(1,1-dicyanomet- hylene)-indanone))-5,5,11,11-tetrakis(4-hexylphenyl)-dithieno[2,3-d:2’,3’-d’]-s-indaceno[1,2-b:5,6-b’]dithiophene (ITIC) on the photovoltaic performances of ternary organic solar cells (OSCs) were systemically investigated. Under 20 wt% ICBA, the simultaneously improvements in the short circuit...
In the past few years, organic film prepared on the silicon (Si) surface has become attractive owing to the wide range of potential application, low cost and good performance. In this paper, perfluorinated organic film was prepared on the Si surface in aqueous solution using one-step dipping method. On the Si surface, 4-nitrobenzene diazonium (NBD) tetrafluoroborate was firstly reduced with the presence...
In three-dimensional packaging (3D packaging) industry, through silicon via (TSV) technology is significant which acts as connection between chips and wafers. TSV technology achieves the interconnection through vertical vias and the formation of silicon vias mainly utilizes laser processing technique or deep reactive ion etching (DRIE) technique at the present stage. In this paper, an electrochemical...
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