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A site‐specific xenon plasma focused ion beam preparation technique for microcantilever samples (1–20 µm width and 1:10 aspect ratio) is presented. The novelty of the methodology is the use of a chunk lift‐out onto a clean silicon wafer to facilitate easy access of a low‐cost probe type indenter which provides bending force measurement. The lift‐out method allows sufficient room for the indenter...
In this paper, the growth behavior of twin boundary in plated copper film was thoroughly investigated using SEM and TEM to facilitate its application as under bump metallization (UBM). The bath consisting of different amounts of H2SO4 was adopted to individually study the influence of pH on cross-sectional microstructure of copper film. Increasing the sulfuric acid concentration could greatly increase...
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